Songhan Plastic Technology Co.,Ltd.

Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Resinlab®
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive.pdf
  Online Service   lookpolymers   27660005
Material Notes:
Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymeric coatings). It cures completely at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and has a free flowing viscosity. It has very good resistance to water, acids and bases and most organic solvents. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP750 Clear will reach full cure at room temperature within 24 –48 hours. Cure time can be accelerated by the application of heat. Times and temperatures from 2 hours at 65°C to 10 minutes at 1 10°C are typical for most applications. Time to heat substrate must be taken into account. Cooler temperatures will also extend work time and increase cure times.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 0.980 g/cc
0.980 g/cc
Part B; TM R050-16
1.07 g/cc
1.07 g/cc
Mixed; TM R050-16
1.16 g/cc
1.16 g/cc
Part A; TM R050-16
Water Absorption 0.060 %

@Time 86400 sec
0.060 %

@Time 24.0 hour
TM R050-35
Viscosity 9000 cP
9000 cP
Part B, RVT, #5, 2.5 rpm; TM R050-12
12500 cP
12500 cP
Mixed; TM R050-12
16000 cP
16000 cP
Part A, RVT, #6, 2.5 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 80
TM R050-17
Tensile Strength at Break 54.5 MPa
7900 psi
TM R050-36
Tensile Strength, Ultimate 55.2 MPa
8000 psi
TM R050-36
Tensile Strength, Yield 24.1 MPa
3500 psi
TM R050-36
Elongation at Break 4.0 - 10 %
4.0 - 10 %
TM R050-36
Tensile Modulus 2.41 GPa
350 ksi
TM R050-36
Compressive Yield Strength 58.6 MPa
8500 psi
TM R050-38
Compressive Strength 172 MPa
25000 psi
Ultimate; TM R050-38
172 MPa
25000 psi
Break; TM R050-38
Compressive Modulus 2.41 GPa
350 ksi
TM R050-38
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Thermal Properties Metric English Comments
CTE, linear 62.0 µm/m-°C

@Temperature <=70.0 °C
34.4 µin/in-°F

@Temperature <=158 °F
below Tg
150 µm/m-°C

@Temperature >=70.0 °C
83.3 µin/in-°F

@Temperature >=158 °F
above Tg
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 70.0 °C
158 °F
TM R050-25
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Electrical Properties Metric English Comments
Volume Resistivity 8.30e+14 ohm-cm
8.30e+14 ohm-cm
Dielectric Constant 3.5

@Frequency 100 Hz,
Temperature 25.0 °C

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 16.1 kV/mm
410 kV/in
Processing Properties Metric English Comments
Cure Time 120 min

@Temperature 65.0 °C
2.00 hour

@Temperature 149 °F
1440 - 4320 min

@Temperature 25.0 °C
24.0 - 72.0 hour

@Temperature 77.0 °F
Pot Life >= 120 min
>= 120 min
Mass: 50g; TM R050-19
Descriptive Properties Value Comments
Color Clear
Mix Ratio 1:1
Copyright © All Rights Reserved