Mechanical Properties | Metric | English | Comments |
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Compressive Yield Strength | 58.6 MPa | 8500 psi | TM R050-38 |
Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymer.. |
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Compressive Yield Strength | 58.6 MPa | 8500 psi | |
Aptek DI-STRATE 95208 Microwave/RF Foam Substrate DI-STRATE™ Tiles are fully-crosslinked, low density, composite foam substrates which exhibit a low characteristics in the microwave frequency range.Uses: Ground/Space Antennas/PCBsInformation provi.. |
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Compressive Yield Strength | 58.6 MPa | 8500 psi | TM R050-38 |
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
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Compressive Yield Strength | 58.6 MPa | 8500 psi | TM R050-38 |
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
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Compressive Yield Strength | 58.6 MPa | 8500 psi | TM R050-38 |
Resinlab® EP1056LC Urethane Modified Epoxy Adhesive Resinlab™ EP1056LC is a two part urethane modified epoxy adhesive designed to give good adhesion to metals and hard to bond surfaces such as PVC. It is thixotropic to provide good gap filling abili.. |