Polymer Property : Cure Time = 2.00 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	120 min @Temperature 66.0 °C	2.00 hour @Temperature 151 °F
Parker Chomerics CHO-BOND 360-208 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E..
Cure Time	120 - 180 min @Temperature 60.0 °C	2.00 - 3.00 hour @Temperature 140 °F
Resin Technology Group 404 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Cure Time	120 min @Temperature 60.0 °C	2.00 hour @Temperature 140 °F
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (..
Cure Time	120 min @Temperature >=65.0 Â°C	2.00 hour @Temperature >=149 Â°F	Handling strength
Lord Adhesives FusorÂ® 380NS / 383NS Epoxy Adhesive LORD FusorÂ® 380NS/383NS adhesive is a two-part, rapid-cure epoxy adhesive used to bond fiberglass reinforced plastics (FRP), sheet molded compounds (SMC) and metals.All information provided by Lo..
Cure Time	120 - 150 min @Temperature 93.3 °C	2.00 - 2.50 hour @Temperature 200 °F
Master Bond EP21AR Acid Resistant Two Component Epoxy Master Bond EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealant with outstanding acid as well as excellent overall chemical resistance. E..
Cure Time	120 min @Temperature 93.3 °C	2.00 hour @Temperature 200 °F
Master Bond EP21HT High Temperature Resistant Two Component Epoxy Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durabl..
Cure Time	120 - 180 min @Temperature 93.3 °C	2.00 - 3.00 hour @Temperature 200 °F
Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one ..
Cure Time	120 - 180 min @Temperature 93.3 °C	2.00 - 3.00 hour @Temperature 200 °F
Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at ..
Cure Time	120 min @Temperature 65.0 °C	2.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 862-7 General Purpose Epoxy Adhesive TRA-BOND 862-7 semi-flexible, nonflowing epoxy paste adhesive is designed for general purpose applications. It is suitable for bonding materials with mismatched coefficients of expansion. This epoxy..
Cure Time	120 min @Temperature 100 °C	2.00 hour @Temperature 212 °F
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur..
Cure Time	120 min @Temperature 125 °C	2.00 hour @Temperature 257 °F
Epoxyset Epoxibond EB-115 Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc...
Cure Time	120 min @Temperature 65.0 °C	2.00 hour @Temperature 149 °F
Epoxyset Epoxiohm EO-21 Electrically Conductive Epoxy Adhesive EO-21 is a two part, silver filled high electrical conductivity epoxy adhesive. It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and..
Cure Time	120 min @Temperature 50.0 °C	2.00 hour @Temperature 122 °F	2nd step
Abatron AboCast 8502-6/AboCure 8502-6 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-6/AboCure 8502-6 is a flexible, colorless, low-exotherm epoxy casting compound for spherical masses up to 2000 grams. It is a 2-component structural and dielectric liquid system with lo..
Cure Time	120 min @Temperature 25.0 °C	2.00 hour @Temperature 77.0 °F
3M AC-250 A-1/6 Aerospace Sealant 3M Aerospace Sealant AC-250 A-1/6 is a two-part, low temperature curing polysulfide, quick repair sealant for integral fuel tank and fuselage sealing applications. The mixed compound is a pourable l..
Cure Time	120 min @Temperature 232 °C	2.00 hour @Temperature 450 °F	Recommended Postcure Cycle
Arlon 56596R065 0.065" (1.65 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone Rubber Side 2: Uncured Silicone Rubber Product Use: Flexible heater insulationAppearance: Red silicone gum and rubber on fiberglass with polymer release li..
Cure Time	120 min @Temperature 204 °C	2.00 hour @Temperature 400 °F	Recommended Postcure Cycle
Arlon CP-410R Bulk Compound Design/Construction: Bulk Compound (packaged in polyethylene) This data Represents typical values for the production material. The data should not be used to write, or in place of, material specific..
Cure Time	120 min @Temperature 260 °C	2.00 hour @Temperature 500 °F	Step 2
Aremco Ceramabond™ 552 High Temperature Ceramic Adhesive/Paste, Alumina Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Cure Time	120 - 240 min @Temperature 120 - 160 °C	2.00 - 4.00 hour @Temperature 248 - 320 °F	optional
Abatron AboCast 8103-30 High-Performance Dielectric Epoxy AboCast 8103-30 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h..
Cure Time	120 min @Temperature 204 °C	2.00 hour @Temperature 400 °F	Recommended Postcure Cycle
Arlon R33468A030 0.0305" (0.775 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSide 2: Cured/Uncured LayersAppearance: Semi-cured blue silicone gum on glass fabricThis data Represents typical values for the production material. ..
Cure Time	120 min @Temperature 204 °C	2.00 hour @Temperature 400 °F	Recommended Postcure Cycle
Arlon R33889R020 0.020" (0.508 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Layer-on-Layer This data Represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information ..
Cure Time	120 min @Temperature 60.0 °C	2.00 hour @Temperature 140 °F
Resinlab® EP1190 Flame Retardant Epoxy Casting Resin Resinlab™ EP1190 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Proje..
Cure Time	120 - 180 min @Temperature 100 °C	2.00 - 3.00 hour @Temperature 212 °F
Master Bond EP42HT-2LO Low Outgassing, Heat Resistant Two Component Epoxy Master Bond Polymer System EP42HT-2LO is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding ..