Polymer Property : CTE, linear = 62.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	62.0 µm/m-°C @Temperature <=70.0 °C	34.4 µin/in-°F @Temperature <=158 °F	below Tg
Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymer..
CTE, linear	62.0 µm/m-°C @Temperature <=100 °C	34.4 µin/in-°F @Temperature <=212 °F	ISO E 830
Wolf Kunststoff ZEDEX® ZX-324V2T A3F PEEK, PTFE Modified Reduced friction; High wear resistance; High elasticity; Stress resistantApplications: Shipbuilding; Chemical Engineering; Automotive Technology; Machine ToolsInformation provided by Zedex
CTE, linear	62.0 µm/m-°C @Temperature 50.0 - 150 °C	34.4 µin/in-°F @Temperature 122 - 302 °F
Dow SiLK™ D Semiconductor Dielectric Resin SiLK™ D resin provides a more controlled coefficient of thermal expansion (CTE) profile at elevated temperatures as compared to earlier versions of SiLK™ resin.Information provided by Dow
CTE, linear	62.0 µm/m-°C @Temperature 5.00 - 25.0 °C	34.4 µin/in-°F @Temperature 41.0 - 77.0 °F	Below Tg
3M Scotch-Weld™ DP190 Gray Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP190 Gray is a 1:1 mix ratio similar to Scotch-Weld™ Epoxy Adhesive 2216 B/A Gray and exhibits good peel, shear and environmental aging properties.Information pro..