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Polymer Property : Adhesive Bond Strength = 17.2 MPa Product List

Mechanical Properties

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Mechanical Properties Metric English Comments
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP950NMF Gray Non-Metallic Filled Rubber Modified Epoxy
Resinlab™ EP950NMF Gray is a non-metallic filled version of EP950G. It is a one-part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated tem..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum
Tra-Con Tra-Bond 2147 Thixotropic Epoxy/Polyamide Adhesive
TRA-BOND 2147 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum
Tra-Con Tra-Bond 2170 Flexible Plastic Bonder
TRA-BOND 2170 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermoplas..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum
Tra-Con Tra-Bond 2170T Flexible Plastic Bonder
TRA-BOND 2170T is a flexible, high viscosity, thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or alm..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, gold to gold, @ 25°C
Tra-Con Tra-Bond 293-14 Electrically Conductive Silver-Filled Epoxy Adhesive
TRA-BOND 293-14 silver-filled, electrically conductive epoxy adhesive is designed to provide strong bonds to difficult-to-bond metals, such as nickel, copper, gold and solder. The stress-absorbing c..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum, 2 hrs @ 65°C
Tra-Con Tra-Bond 862-12
Information provided by Tra-Con Inc.
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum, 2 hrs @ 150°C
Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant
TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum
Tra-Con Tra-Bond F123HV Color Keyed Thixotropic Epoxy Adhesive
TRA-BOND F123 HV is a fast cure, high viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum
Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive
TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum, 1 hr @ 100°C
Tra-Con Tra-Bond FS227 Thixotropic Epoxy/Polyamide Adhesive
TRA-BOND FS227 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wettin..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, pvc to pvc
Tra-Con Tra-Bond FS420 Flexible Plastic Adhesive
TRA-BOND FS-420 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermopl..
Adhesive Bond Strength >= 17.2 MPa
>= 2500 psi
Shear, Al/Al
Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy
Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum, @ 25°C
Tra-Con Tra-Bond 2211 High Temperature Epoxy Adhesive
TRA-BOND 2211 is a low viscosity epoxy adhesive system recommended for industrial bonding applications where superior wetting and good mechanical and electrical insulation performance features are r..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum, @ 25°C
Tra-Con Tra-Bond 862-7 General Purpose Epoxy Adhesive
TRA-BOND 862-7 semi-flexible, nonflowing epoxy paste adhesive is designed for general purpose applications. It is suitable for bonding materials with mismatched coefficients of expansion. This epoxy..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum
Tra-Con Tra-Bond Ablebond 744-2NTN1 Electrically Insulating Polyimide Adhesive
Ablebond 744-2NTN1 structural epoxy adhesive is a nonsag version of 744-2 adhesive. Information provided by Tra-Con Inc.
Adhesive Bond Strength 17.2 MPa
2500 psi
Trelleborg Emerson & Cuming Eccobond® A 316 Filler End Cap Epoxy Adhesive
Emerson & Cuming A 316 Eccobond® Filler End Cap Epoxy AdhesiveOne component, pourable, fast heat curing, epoxy adhesive. Exhibits excellent thermal stability and resistance to chemicals. Used as en..
Adhesive Bond Strength 17.2 MPa
2500 psi
Trelleborg Emerson & Cuming Eccobond® A316-48 One-Component Fast Cure Epoxy Adhesive
Emerson & Cuming A316-48 Eccobond® One-Component Fast Cure Epoxy AdhesivePourable, fast heat curing, epoxy adhesive and insulation compound. Excellent chemical and heat resistance. Cure Type: Heat ..
Adhesive Bond Strength 17.2 MPa
2500 psi
Adhesive tensile shear strength; ASTM D1002
Devcon HVAC Repair (Special F) Epoxy
General Repair EpoxyComments: Aluminum-filled epoxy adhesive, conveniently packaged in two 6.5 oz. tubes. Bonds to aluminum and other metals, ceramics, wood, concrete or glass. Use as an adhesive ..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap Shear Strength
Epoxyset Epoxibond EB-103F Unfilled Epoxy Adhesive
A two-component, unfilled, fast setting epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-103F has excellent bond strength to v..
Adhesive Bond Strength 17.2 MPa
2500 psi
adhesion to steel after 3 days at 72°F; ASTM D3330
Dow Saran® 520 Vapor Retarder Tape
Saran™ 520 Vapor Retarder Tape is a Vapor Retarder Film coated with acrylic adhesive designed for long-lasting adhesion and wide temperature range performance. Information provided by Dow
Adhesive Bond Strength 17.2 MPa
2500 psi
initial adhesion to Saran™ film; ASTM D3330
Dow Saran® 520 Vapor Retarder Tape
Saran™ 520 Vapor Retarder Tape is a Vapor Retarder Film coated with acrylic adhesive designed for long-lasting adhesion and wide temperature range performance. Information provided by Dow
Adhesive Bond Strength 17.2 MPa

@Temperature 82.2 °C
2500 psi

@Temperature 180 °F
Aluminum-Aluminum tensile shear
Armstrong A-5/E Epoxy Adhesive
Information provided by Ellsworth Adhesives.
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum
Tra-Con Tra-Bond 724-17GR1B3 Polyurethane Adhesive
TRA-BOND 724-17GR1B3 premixed and frozen polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, myl..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1026 Clear Epoxy Adhesive
Resinlab™ EP1026 Clear is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in ..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1290 Gray Mineral Filled Epoxy Adhesive
Resinlab™ EP1290 Gray is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to m..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1190 Flame Retardant Epoxy Casting Resin
Resinlab™ EP1190 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Proje..
Adhesive Bond Strength >= 17.2 MPa
>= 2500 psi
Shear, Al/Al
Master Bond Supreme 46HT-2ND2 Two Component, Non-Drip, Toughened, Epoxy Adhesive
Master Bond Polymer Supreme 46HT-2ND2 is a two component, non-drip, epoxy adhesive featuring an attractive balance of superior shear and peel strengths for high performance structural bonding suitab..
Adhesive Bond Strength >= 17.2 MPa
>= 2500 psi
Shear, Al/Al, after 30 days at 400°F
Master Bond Supreme 46HT-2ND2 Two Component, Non-Drip, Toughened, Epoxy Adhesive
Master Bond Polymer Supreme 46HT-2ND2 is a two component, non-drip, epoxy adhesive featuring an attractive balance of superior shear and peel strengths for high performance structural bonding suitab..
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