Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP950NMF Gray Non-Metallic Filled Rubber Modified Epoxy Resinlab™ EP950NMF Gray is a non-metallic filled version of EP950G. It is a one-part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated tem.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 2147 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND 2147 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 2170 Flexible Plastic Bonder TRA-BOND 2170 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermoplas.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 2170T Flexible Plastic Bonder TRA-BOND 2170T is a flexible, high viscosity, thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or alm.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, gold to gold, @ 25°C |
Tra-Con Tra-Bond 293-14 Electrically Conductive Silver-Filled Epoxy Adhesive TRA-BOND 293-14 silver-filled, electrically conductive epoxy adhesive is designed to provide strong bonds to difficult-to-bond metals, such as nickel, copper, gold and solder. The stress-absorbing c.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, 2 hrs @ 65°C |
Tra-Con Tra-Bond 862-12 Information provided by Tra-Con Inc. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, 2 hrs @ 150°C |
Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond F123HV Color Keyed Thixotropic Epoxy Adhesive TRA-BOND F123 HV is a fast cure, high viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, 1 hr @ 100°C |
Tra-Con Tra-Bond FS227 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND FS227 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wettin.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, pvc to pvc |
Tra-Con Tra-Bond FS420 Flexible Plastic Adhesive TRA-BOND FS-420 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermopl.. |
|||
Adhesive Bond Strength | >= 17.2 MPa | >= 2500 psi | Shear, Al/Al |
Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, @ 25°C |
Tra-Con Tra-Bond 2211 High Temperature Epoxy Adhesive TRA-BOND 2211 is a low viscosity epoxy adhesive system recommended for industrial bonding applications where superior wetting and good mechanical and electrical insulation performance features are r.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, @ 25°C |
Tra-Con Tra-Bond 862-7 General Purpose Epoxy Adhesive TRA-BOND 862-7 semi-flexible, nonflowing epoxy paste adhesive is designed for general purpose applications. It is suitable for bonding materials with mismatched coefficients of expansion. This epoxy.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond Ablebond 744-2NTN1 Electrically Insulating Polyimide Adhesive Ablebond 744-2NTN1 structural epoxy adhesive is a nonsag version of 744-2 adhesive. Information provided by Tra-Con Inc. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | |
Trelleborg Emerson & Cuming Eccobond® A 316 Filler End Cap Epoxy Adhesive Emerson & Cuming A 316 Eccobond® Filler End Cap Epoxy AdhesiveOne component, pourable, fast heat curing, epoxy adhesive. Exhibits excellent thermal stability and resistance to chemicals. Used as en.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | |
Trelleborg Emerson & Cuming Eccobond® A316-48 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming A316-48 Eccobond® One-Component Fast Cure Epoxy AdhesivePourable, fast heat curing, epoxy adhesive and insulation compound. Excellent chemical and heat resistance. Cure Type: Heat .. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Adhesive tensile shear strength; ASTM D1002 |
Devcon HVAC Repair (Special F) Epoxy General Repair EpoxyComments: Aluminum-filled epoxy adhesive, conveniently packaged in two 6.5 oz. tubes. Bonds to aluminum and other metals, ceramics, wood, concrete or glass. Use as an adhesive .. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap Shear Strength |
Epoxyset Epoxibond EB-103F Unfilled Epoxy Adhesive A two-component, unfilled, fast setting epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-103F has excellent bond strength to v.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | adhesion to steel after 3 days at 72°F; ASTM D3330 |
Dow Saran® 520 Vapor Retarder Tape Saran™ 520 Vapor Retarder Tape is a Vapor Retarder Film coated with acrylic adhesive designed for long-lasting adhesion and wide temperature range performance. Information provided by Dow |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | initial adhesion to Saran™ film; ASTM D3330 |
Dow Saran® 520 Vapor Retarder Tape Saran™ 520 Vapor Retarder Tape is a Vapor Retarder Film coated with acrylic adhesive designed for long-lasting adhesion and wide temperature range performance. Information provided by Dow |
|||
Adhesive Bond Strength | 17.2 MPa @Temperature 82.2 °C |
2500 psi @Temperature 180 °F |
Aluminum-Aluminum tensile shear |
Armstrong A-5/E Epoxy Adhesive Information provided by Ellsworth Adhesives. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 724-17GR1B3 Polyurethane Adhesive TRA-BOND 724-17GR1B3 premixed and frozen polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, myl.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1026 Clear Epoxy Adhesive Resinlab™ EP1026 Clear is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in .. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1290 Gray Mineral Filled Epoxy Adhesive Resinlab™ EP1290 Gray is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to m.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
|||
Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1190 Flame Retardant Epoxy Casting Resin Resinlab™ EP1190 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Proje.. |
|||
Adhesive Bond Strength | >= 17.2 MPa | >= 2500 psi | Shear, Al/Al |
Master Bond Supreme 46HT-2ND2 Two Component, Non-Drip, Toughened, Epoxy Adhesive Master Bond Polymer Supreme 46HT-2ND2 is a two component, non-drip, epoxy adhesive featuring an attractive balance of superior shear and peel strengths for high performance structural bonding suitab.. |
|||
Adhesive Bond Strength | >= 17.2 MPa | >= 2500 psi | Shear, Al/Al, after 30 days at 400°F |
Master Bond Supreme 46HT-2ND2 Two Component, Non-Drip, Toughened, Epoxy Adhesive Master Bond Polymer Supreme 46HT-2ND2 is a two component, non-drip, epoxy adhesive featuring an attractive balance of superior shear and peel strengths for high performance structural bonding suitab.. |