Mechanical Properties | Metric | English | Comments |
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Compressive Modulus | 2.41 GPa | 350 ksi | Mixed 1:1; TM R050-38 |
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | ASTM D695 |
Quadrant EPP Acetron® AF Blend POM-H Acetal Extruded PTFE-Filled Acetal Homopolymer (ASTM Product Data Sheet) |
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Compressive Modulus | 2.41 GPa | 350 ksi | TM R050-38 |
Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymer.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | ASTM D695 |
Quadrant EPP Duratron® PAI T4503 Compression Molded, Polyamide-imide, Eelectrical Grade (ASTM Product Data Sheet) |
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Compressive Modulus | 2.41 GPa | 350 ksi | ASTM D695 |
Quadrant EPP Duratron® PAI T4540 Polyamide-imide, compression molded (ASTM Product Data Sheet) |
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Compressive Modulus | 2.41 - 4.14 GPa | 350 - 600 ksi | Average value: 2.86 GPa Grade Count:4 |
Overview of materials for Polyamide-Imide, Molded This property data is a summary of similar materials in the MatWeb database for the category "Polyamide-Imide, Molded". Each property range of values reported is minimum and maximum values of approp.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | Stabilized, typ |
Hexcel® HexWeb® CR III 5/32-5056-.002 Corrosion Resistant Specification Grade Aluminum Honeycomb Grade is designated as "Cell Size-Alloy-Foil Gauge."5052 and 5056 expanded aerospace grade aluminum honeycomb materials are available in a wide selection of cell sizes and foil gauges. The HexWeb CR.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | Stabilized, typ |
Hexcel® HexWeb® CR-PAA™ 1/8-5052-0.002 Phosphoric Acid Anodized Aluminum Honeycomb Grade is designated as "Cell Size-Alloy-Foil Gauge." The life cycle of aluminum honeycomb sandwich structures in a given application can be directly related to the quality of the bond between the fa.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | Stabilized, typ |
Hexcel® HexWeb® CR III 3/16-5052-.003 Corrosion Resistant Specification Grade Aluminum Honeycomb Grade is designated as "Cell Size-Alloy-Foil Gauge."5052 and 5056 expanded aerospace grade aluminum honeycomb materials are available in a wide selection of cell sizes and foil gauges. The HexWeb CR.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | Stabilized, typ |
Hexcel® HexWeb® CR-PAA™ 3/16-5052-0.003 Phosphoric Acid Anodized Aluminum Honeycomb Grade is designated as "Cell Size-Alloy-Foil Gauge." The life cycle of aluminum honeycomb sandwich structures in a given application can be directly related to the quality of the bond between the fa.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | Stabilized, typ |
Hexcel® HexWeb® CR-PAA™ 5/32-5056-0.002 Phosphoric Acid Anodized Aluminum Honeycomb Grade is designated as "Cell Size-Alloy-Foil Gauge." The life cycle of aluminum honeycomb sandwich structures in a given application can be directly related to the quality of the bond between the fa.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | ASTM D-695 |
CMT Materials REN Shape® 5008 Vacuum Forming Tooling Board REN SHAPE 5008 is a tooling board specifically designed for use in vacuum forming. It is designed for use up to 250°F and is well suited for building vacuum forming molds as well as master models,.. |
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Compressive Modulus | >= 2.41 GPa | >= 350 ksi | ASTM D3410 |
Arlon AD250C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs For RF & Microwave Printed Circuit Boards. Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)Dielectric Constant (2.50) with Tight Tolerance.. |
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Compressive Modulus | >= 2.41 GPa | >= 350 ksi | ASTM D3410 |
Arlon AD255C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs For RF & Microwave Printed Circuit Boards. Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)Dielectric Constant (2.55) with Tighter Toleran.. |
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Compressive Modulus | >= 2.41 GPa | >= 350 ksi | ASTM D695 |
Arlon AD260A PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs For RF & Microwave Printed Circuit Boards. Low Loss PTFE and Ceramic Filled Composite Dielectric Constant (2.60)Low Dielectric Loss (Loss Tangent)Low Profile Copper (lower conductive losses)Low Z-d.. |
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Compressive Modulus | >= 2.41 GPa | >= 350 ksi | ASTM D695 |
Arlon AD350A PTFE/Woven Fiberglass/Ceramic Filled Composite Tighter Dielectric Tolerance Low Z-Axis Thermal ExpansionCeramic Filled PTFEHigh Thermal ConductivityLarge Panel SizeBenefits:Higher Consistency of PerformanceSuperior PTH AdhesionHeat Dissipation a.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | ASTM D695 |
Quadrant EPP Quadrant CPVC - ASTM D1748, Cell Classification (ASTM Product Data Sheet) |
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Compressive Modulus | 2.41 GPa | 350 ksi | TM R050-38 |
Resinlab® EP1238 Acrylic / Epoxy Hybrid Adhesive Resinlab™ EP1238 is a two part acrylic / epoxy hybrid adhesive designed for bonding metals and plastics. It cures quickly at room temperature to a tough, semi-rigid material. It has good wetting to.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | Stabilized, typ |
Hexcel® HexWeb® CR III 1/8-5052-.002 Corrosion Resistant Specification Grade Aluminum Honeycomb Grade is designated as "Cell Size-Alloy-Foil Gauge."5052 and 5056 expanded aerospace grade aluminum honeycomb materials are available in a wide selection of cell sizes and foil gauges. The HexWeb CR.. |
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Compressive Modulus | 2.41 GPa | 350 ksi | ASTM D695 |
Quadrant EPP Quadrant PVC Polyvinyl Chloride, Type I, Grade 1 (ASTM Product Data Sheet) |
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Compressive Modulus | 2.41 GPa | 350 ksi | TM R050-38 |
Resinlab® EP1238 Black Acrylic / Epoxy Hybrid Adhesive Resinlab™ EP1238 Black is a two part acrylic / epoxy hybrid adhesive designed for bonding metals and plastics. It cures quickly at room temperature to a tough, semi-rigid material. It has good wett.. |