Master Bond EP34AO Epoxy Compound Withstands High Temperatures

Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio of 100/70, by weight. Physical properties are maintained even after long exposure to temperatures in the 400-450°F range. Master Bond Polymer System EP34AO is easily mixed and can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents. A lower viscosity version called EP34AOLV suitable for potting and encapsulation is also available. EP34AO is resistant to repeated thermal cycling and resists chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to 450°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured epoxy is a good electrical insulator. Color of part A tan, part B amber. Master Bond Polymer System EP34AO offers thermal conductivity along with the convenience of a room temperature cure with high temperature resistance and is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries. Product Advantages: convenient mixing; non critical 100/70 equal weight easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required high bonding strength to a wide variety of substrates low coefficient of expansion, low shrinkage, good dimensional stability good durability, thermal shock and chemical resistance outstanding thermal conductivity, over 10 BTU-in/hr-ft²-°F excellent electrical insulating properties good temperature resistance up to 450°FInformation provided by MasterBond®