Songhan Plastic Technology Co.,Ltd.

Master Bond EP34AO Epoxy Compound Withstands High Temperatures

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP34AO Epoxy Compound Withstands High Temperatures.pdf
  Online Service   lookpolymers   27660005
Material Notes:
Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio of 100/70, by weight. Physical properties are maintained even after long exposure to temperatures in the 400-450°F range. Master Bond Polymer System EP34AO is easily mixed and can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents. A lower viscosity version called EP34AOLV suitable for potting and encapsulation is also available. EP34AO is resistant to repeated thermal cycling and resists chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to 450°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured epoxy is a good electrical insulator. Color of part A tan, part B amber. Master Bond Polymer System EP34AO offers thermal conductivity along with the convenience of a room temperature cure with high temperature resistance and is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries. Product Advantages: convenient mixing; non critical 100/70 equal weight easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required high bonding strength to a wide variety of substrates low coefficient of expansion, low shrinkage, good dimensional stability good durability, thermal shock and chemical resistance outstanding thermal conductivity, over 10 BTU-in/hr-ft²-°F excellent electrical insulating properties good temperature resistance up to 450°FInformation provided by MasterBond®
Mechanical Properties Metric English Comments
Hardness, Shore D >= 85
>= 85
Tensile Strength at Break 37.9 MPa
5500 psi
Shear Strength 13.1 MPa
1900 psi
Bond, Al to Al, after 30 days water immersion
13.4 MPa
1950 psi
Bond, Al to Al, RT Cure
Thermal Properties Metric English Comments
CTE, linear 22.0 - 24.0 µm/m-°C
12.2 - 13.3 µin/in-°F
Thermal Conductivity 1.44 W/m-K
10.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 232 °C
450 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+13 ohm-cm
>= 1.00e+13 ohm-cm
Dielectric Strength >= 15.7 kV/mm

@Thickness 3.17 mm
>= 400 kV/in

@Thickness 0.125 in
Processing Properties Metric English Comments
Cure Time 180 - 240 min

@Temperature 93.3 °C
3.00 - 4.00 hour

@Temperature 200 °F
1440 - 4320 min

@Temperature 23.9 °C
24.0 - 72.0 hour

@Temperature 75.0 °F
Pot Life 50 - 60 min
50 - 60 min
100 gram batch
Shelf Life 6.00 Month

@Temperature 23.9 °C
6.00 Month

@Temperature 75.0 °F
in unopened container
Descriptive Properties Value Comments
Mixing Ratio (A to B) 100/70
by weight or volume
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