Polymer Property : Cure Time = 240 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
NextGen Adhesives G907-31 Epoxy Adhesive Description: NGAC G907-31 is a medium viscosity epoxy adhesive system utilized extensively in industrial and structural applications.Advantages and Applications: The NGAC G907-31 provides excellent ..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
NextGen Adhesives M907-19 Medical Grade Epoxy Adhesive Description: NGAC M907-19 is a medium viscosity and thixotropic adhesive system that is specifically formulated for medical device assembly applications.Advantages and Applications: Uses include lam..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Resin Technology Group 401 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy 100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv..
Cure Time	180 - 240 min @Temperature 65.6 °C	3.00 - 4.00 hour @Temperature 150 °F
Master Bond EP21TDC-4 Two Component, Highly Flexible Epoxy System Master Bond Polymer System EP21TDC-4 is a two component, flexible epoxy resin system for high performance bonding, sealing and coating. It is formulated to cure at ambient temperatures or more quick..
Cure Time	180 - 240 min @Temperature 121 - 149 °C	3.00 - 4.00 hour @Temperature 250 - 300 °F
Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea..
Cure Time	180 - 240 min @Temperature 121 - 149 °C	3.00 - 4.00 hour @Temperature 250 - 300 °F
Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr..
Cure Time	180 - 240 min @Temperature 65.6 °C	3.00 - 4.00 hour @Temperature 150 °F
Master Bond EP76M-1R Nickel Conductive Epoxy Adhesive Description: Master Bond Polymer System EP76M-1R is a two component, nickel filled, electrically conductive adhesive for high performance bonding formulated to cure at room temperature or more rapid..
Cure Time	120 - 240 min @Temperature 65.0 °C	2.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 216D02 Thixotropic No-Sag Epoxy Adhesive TRA-BOND 216D02 is a thixotropic, two part epoxy adhesive formulated specifically for applications where a nonsagging adhesive is required. TRA-BOND 216D02 works in concert with TRA-CAST 3135 to per..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 216L01 Clear Low Viscosity Epoxy Adhesive TRA-BOND 216L01 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to g..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 716K02 Thixotropic Adhesive 716K02 is a more thixotropic version of FDA2T. Information provided by Tra-Con Inc.
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FDA2YL02 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 YL02 is a medium viscosity epoxy resin system specifically developed for adhesive and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug..
Cure Time	180 - 240 min @Temperature 93.3 °C	3.00 - 4.00 hour @Temperature 200 °F
Master Bond EP21TDC-7 Highly Flexible Two Component Epoxy System Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or mor..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 813J01 Silicone Encapsulant TRA-BOND 813J01 is a silicone adhesive system formulated to provide excellent thermal conductivity. This unique product bonds well to difficult substrates. Typical applications include encapsulation..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FS437 Low Viscosity High Impact Epoxy Adhesive TRA-BOND FS437 is a two-part, low viscosity material formulated for optical applications which require excellent wicking, visible color and high strength. This material has been used successfully fo..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Duct 916D01 Electrically Conductive Silver-Filled Epoxy TRA-DUCT 916D01 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical pr..
Cure Time	60.0 - 240 min @Temperature 120 - 160 °C	1.00 - 4.00 hour @Temperature 248 - 320 °F	optional
Abatron AboCast 8103-24 High-Performance Dielectric Epoxy AboCast 8103-24 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has an exc..
Cure Time	120 - 240 min @Temperature 120 - 160 °C	2.00 - 4.00 hour @Temperature 248 - 320 °F	optional
Abatron AboCast 8103-26 High-Performance Dielectric Epoxy AboCast 8103-26 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND FDA2 Epoxy Adhesive AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and recei..
Cure Time	60.0 - 240 min @Temperature 160 - 180 °C	1.00 - 4.00 hour @Temperature 320 - 356 °F	optional
Abatron AboCast 8103-14 One-Component Epoxy AboCast 8103-14 is the lowest-viscosity one-component epoxy system with heavy-duty structural and dielectric properties. It is clear and has maximum wetting and penetration. Suggested Uses: Casting..
Cure Time	120 - 240 min @Temperature 125 °C	2.00 - 4.00 hour @Temperature 257 °F	optional 3rd step
Abatron AboCast 8502-7/AboCure 8502-7 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-7/AboCure 8502-7 is a rigid, heat cured, colorless, low-exotherm epoxy casting compound for larger masses. It is a 2-component structural and dielectric liquid system with extremely low..
Cure Time	60.0 - 240 min @Temperature 160 - 180 °C	1.00 - 4.00 hour @Temperature 320 - 356 °F	optional
Abatron AboCast 8504-1 One-Component Epoxy AboCast 8504-1 is a clear, all-purpose one-component epoxy system, with an optimum balance of properties for most casting, adhesive, impregnation, and coating applications.
Cure Time	60.0 - 240 min @Temperature 120 - 160 °C	1.00 - 4.00 hour @Temperature 248 - 320 °F	optional
Abatron AboCast 8103-22 High-Performance Dielectric Epoxy AboCast 8103-22 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system is used in..
Cure Time	180 - 240 min @Temperature 23.9 °C	3.00 - 4.00 hour @Temperature 75.0 °F
Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig..