- HOME
- POLYMER SEARCH
- Polymer Property : CTE, linear = 22.0 µm/m-°C
Polymer Property : CTE, linear = 22.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| North Wood Plastics PS with 60% Wood Fiber Data provided by North Wood Plastics, Inc. |
|||
| CTE, linear | 22.0 - 43.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 - 23.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics Lexan® LGK4030 PC (Asia Pacific) |
|||
| CTE, linear | 22.0 - 50.0 µm/m-°C | 12.2 - 27.8 µin/in-°F | Average value: 36.0 µm/m-°C Grade Count:3 |
| Overview of materials for Polystyrene, Wood Filled This property data is a summary of similar materials in the MatWeb database for the category "Polystyrene, Wood Filled". Each property range of values reported is minimum and maximum values of appro.. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate semiconductor devi.. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Cookson Group Plaskon® 1031 Conventional Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discre.. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Cookson Group Plaskon® 3200LS Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability under very stringent testing. This material is designed to minimize stress on the encapsulated .. |
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-7920/RD PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 19-7276 Polyamide 46, with carbon fiber and PTFE Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp.. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Indium Corp. Indalloy® 19 In-Bi-Sn Fusible Alloy Environmentally safe fusible alloy. Contains no lead or cadmium.Information provided by the manufacturer, Indium Corporation. |
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105/GF/30/NAT-2 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-0895/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-7826/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-8389/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
| GEHR Plastics PEEK-30GF Polyetheretherketone, 30% Glass Fiber Polyether etherketone can be used at very high temperatures and it shows a good mechanical strength, toughness, hardness, flexural strength, and torsional strength. PEEK exhibits excellent chemical .. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Indium Corp. Indalloy 108 Tin-Lead Solder Alloy Good pre-tinning alloyInformation Provided by Indium Corporation |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Indium Corp. Indalloy® 290 In-Ag Solder Alloy Indium with silver added to improve strength. Has the wettability and low-temperature malleability of indium. Particularly useful for cryogenic applications.Information provided by the manufacturer,.. |
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-0918/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
|||
| CTE, linear | 22.0 - 25.0 µm/m-°C | 12.2 - 13.9 µin/in-°F | |
| Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi.. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Williams Advanced Alloys WS143 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Williams Advanced Alloys WS235 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
|||
| CTE, linear | 22.0 - 24.0 µm/m-°C | 12.2 - 13.3 µin/in-°F | |
| Master Bond EP34AO Epoxy Compound Withstands High Temperatures Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity .. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive TRA-BOND 2125 is a medium viscosity, low density syntactic foam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting.. |
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| AIM 95Sn/3.5Ag/1.5In Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Petra® 140 BK-112 45% Glass Filled PET Petra 140 BK-112 is a 45% glass reinforced, pigmented black, polyethylene terephthalate (PET) injection molding compound offering an increased level of strength, stiffness, high temperature performa.. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Solvay Specialty Polymers Ixef® 2530/X9027 Polyarylamide, 55% Mineral + Glass Fiber, DAM
(discontinued **)< The IXEF compounds are a family of semi-crystalline polyarylamide thermoplastics reinforced with glass fibers and/or mineral fillers for injection molding.Data provided by the manufacturer, Solvay A.. |
|||
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
ASTM D-696 |
| Glastic GLASGUARD Scuff and Bulkhead Liners GlasGuard Scuff and Bulkhead Liners serve as a method of protecting trailer walls from damage caused by forklift trucks and careless loading and unloading of freight. Manufactured of 1/4" thick fib.. |
|||
| CTE, linear | 22.0 - 71.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 - 39.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL PX2935 PPE+PS (Asia Pacific) PPE/PS, GF20%, non-FR |
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-7251 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High dimensionally stable precision parts, high continuous use tempera.. |
|||
Copyright © lookpolymers.com All Rights Reserved