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- Polymer Property : CTE, linear = 12.2 µin/in-°F
Polymer Property : CTE, linear = 12.2 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| North Wood Plastics PS with 60% Wood Fiber Data provided by North Wood Plastics, Inc. |
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| CTE, linear | 22.0 - 43.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 - 23.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics Lexan® LGK4030 PC (Asia Pacific) |
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| CTE, linear | 22.0 - 500 µm/m-°C | 12.2 - 278 µin/in-°F | Average value: 83.0 µm/m-°C Grade Count:13 |
| Overview of materials for Polyphthalamide (PPA), 20% Glass Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polyphthalamide, 20% Glass Fiber Reinforced". Specific grades with glass content between 15% and 24% are.. |
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| CTE, linear | 22.0 - 50.0 µm/m-°C | 12.2 - 27.8 µin/in-°F | Average value: 36.0 µm/m-°C Grade Count:3 |
| Overview of materials for Polystyrene, Wood Filled This property data is a summary of similar materials in the MatWeb database for the category "Polystyrene, Wood Filled". Each property range of values reported is minimum and maximum values of appro.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| Cookson Group Plaskon® 3400FP Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs .. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-7192 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | |
| Lord Adhesives Circalokâ„¢ 6037 Epoxy Adhesive Circalokâ„¢ 6037 is an epoxy adhesive formulated for use by the semiconductor industry. An easy-to-spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of ther.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105/GF/30/TF/15 PEEK, with glass fiber and PTFE Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Dynamic stressed parts at high movement velocity.Chemical and hydrolysis resistance parts,.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-0797 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High dimensionally stable precision parts, high continuous use tempera.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-0895/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-0923/GY2 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High dimensionally stable precision parts, high continuous use tempera.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-7826/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-8402 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Indium Corp. Indalloy 108 Tin-Lead Solder Alloy Good pre-tinning alloyInformation Provided by Indium Corporation |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy 240 Bismuth-Lead-Tin Solder Alloy Information Provided by Indium Corporation |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 158 Bi-Pb-Sn-Cd Solder Alloy Lowest melting point solder. Good fusible alloy used for lens blocking.Information provided by the manufacturer, Indium Corporation. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 290 In-Ag Solder Alloy Indium with silver added to improve strength. Has the wettability and low-temperature malleability of indium. Particularly useful for cryogenic applications.Information provided by the manufacturer,.. |
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| CTE, linear | 22.0 - 34.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 - 18.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL PX2956 PPE+PS (Asia Pacific) PPE+PS GF+Mineral Filler total 35% FR V-0 |
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| CTE, linear | 22.0 µm/m-°C @Temperature 23.0 - 85.0 °C |
12.2 µin/in-°F @Temperature 73.4 - 185 °F |
ASTM E831 |
| Solvay Technyl® A 218 V35 Nylon 66, 35% Glass Fiber, EH0 Polyamides PA66, reinforced with 35% of glass fiber, heat stabilized, for injection molding.Technyl A 218 V35 is used in all sectors of industry, offering an excellent combination between thermal an.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
12.2 µin/in-°F @Temperature 73.4 - 140 °F |
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| Sumitomo Bakelite Sumikon® PM-9501 Glass-Filled Phenolic, Compression Grade Sumikon PM-9501 is a two stage glass fiber and mineral filled black phenolic special purpose molding compound. It is especially designed for applications requiring high strength and dimensional s.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
12.2 µin/in-°F @Temperature 73.4 - 140 °F |
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| Sumitomo Bakelite Sumikon® PM-9501 Glass-Filled Phenolic, Injection Grade Sumikon PM-9501 is a two stage glass fiber and mineral filled black phenolic special purpose molding compound. It is especially designed for applications requiring high strength and dimensional s.. |
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| CTE, linear | 22.0 - 25.0 µm/m-°C | 12.2 - 13.9 µin/in-°F | |
| Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | ISO 11359-2 |
| Unitika A1022GFL60 PA6, 60% Glass Fiber Reinforced, Dry Information provided by Unitika Ltd. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | |
| Hippe PEEK BG Polyetheretherketone with carbon fiber, PTFE and graphite The addition to PEEK of carbon fiber, PTFE and graphite results in a material with high mechanical strength, a low coefficient of sliding friction and enhanced resistance to abrasion. The outstandi.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| AIM 95Sn/3.5Ag/1.5In Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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| CTE, linear | 22.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Petra® 230 BK-112 22/13% Glass/Mineral Filled PET Petra 230 BK-112 is a 35% mineral and glass fiber reinforced, black pigmented, polyethylene terephthalate injection molding compound. It exhibits a very good combination of performance properties in.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-7173/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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