Thermal Properties | Metric | English | Comments |
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CTE, linear | 15.0 - 24.0 µm/m-°C | 8.33 - 13.3 µin/in-°F | Average value: 22.9 µm/m-°C Grade Count:10 |
Overview of materials for Diallyl Phthalate (DAP) Molding Compound, Long Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Diallyl Phthalate (DAP) Molding Compound, Long Glass Fiber Filled". Each property range of values report.. |
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CTE, linear | 21.0 - 24.0 µm/m-°C | 11.7 - 13.3 µin/in-°F | |
Master Bond EP21SC-1 Two Component Epoxy Resin System Product Description: Master Bond Polymer System EP21SC-1 is a two component epoxy system featuring abrasion resistance. This high performance compound utilizes silicon carbide as a filler material a.. |
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CTE, linear | 22.0 - 24.0 µm/m-°C | 12.2 - 13.3 µin/in-°F | |
Master Bond EP34AO Epoxy Compound Withstands High Temperatures Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity .. |