Polymer Property : Thermal Conductivity = 1.44 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.44 W/m-K @Temperature 80.0 °C	9.99 BTU-in/hr-ft²-°F @Temperature 176 °F	ASTM C518
Rogers Corporation RT/duroid® 6035HTC Ceramic Filled PTFE Composite, High Power RF and Microwave Features & Benefits:High thermal conductivity - Improved dielectric heat dissipation, enabling lower operating temperatures for high power applicationsLow loss tangent - Excellent high frequency per..
Thermal Conductivity	1.44 W/m-K	10.0 BTU-in/hr-ft²-°F
Resin Technology Group KONA 870FT-FR Fire Retardant Epoxy Casting System Mix ratio 100 to 4 by weight.KONA 870 FTFR with HARDENER #9 is a versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. It is recommended for ele..
Thermal Conductivity	>= 1.44 W/m-K	>= 10.0 BTU-in/hr-ft²-°F
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t..
Thermal Conductivity	1.44 W/m-K	10.0 BTU-in/hr-ft²-°F
Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Thermal Conductivity	>= 1.44 W/m-K	>= 10.0 BTU-in/hr-ft²-°F
Master Bond FL901S Silver Filled, Electrically Conductive Adhesive Film Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerat..
Thermal Conductivity	1.44 - 1.59 W/m-K	10.0 - 11.0 BTU-in/hr-ft²-°F
Master Bond Super Gel 9AOND Dimensionally Stable Urethane Modified Epoxy Master Bond Super Gel 9AOND is a two component, urethane modified epoxy system that cures at room temperature and has a paste-like consistency. It offers softness and retains dimensional stability. ..
Thermal Conductivity	1.44 W/m-K	10.0 BTU-in/hr-ft²-°F
Master Bond EP34AO Epoxy Compound Withstands High Temperatures Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity ..
Thermal Conductivity	1.44 W/m-K	10.0 BTU-in/hr-ft²-°F
Master Bond Supreme 11AO Electrically Isolating Adhesive and Sealant Description: Master Bond Polymer System SURPEME 11AO is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated..
Thermal Conductivity	1.44 W/m-K	10.0 BTU-in/hr-ft²-°F
Cotronics Resbond™ 904 Ultra Temp Zirconia Adhesive and Coating Ultra Temp 904 is a smooth creamy paste that is easily brushed on ceramics, graphite, metals, etc. to form adhesive bonds and coatings that will withstand 4000°F (2200°C) continuous heat. It has ..
Thermal Conductivity	1.44 W/m-K	10.0 BTU-in/hr-ft²-°F
Cotronics Resbond™ 905 High Temperature Ceramic Adhesive, Low Expansion
Thermal Conductivity	1.44 W/m-K	10.0 BTU-in/hr-ft²-°F
Cotronics Resbond™ 954 High Temperature Ceramic Adhesive, Stainless Steel Composition
Thermal Conductivity	1.44 W/m-K @Temperature 93.3 °C	10.0 BTU-in/hr-ft²-°F @Temperature 200 °F
Crucible Steel CSM® 21 17Cr-4Ni Precipitation Hardening Stainless Steel CSM 21 is a precipitation hardening stainless mold steel, providing outstanding corrosion resistance and toughness, good polishability, and moderate wear resistance, combined with simple heat treatm..
Thermal Conductivity	1.44 W/m-K	9.99 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..