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Polymer Property : Cure Time = 3.00 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 180 - 360 min

@Temperature 25.0 °C
3.00 - 6.00 hour

@Temperature 77.0 °F
De-mold Time
Northstar Polymers MCP-V40A Polyurethane Gel
MCP-V40A is a polyurethane gel formulation specifically designed for padding and cushioning applications, where low rebound property of the material is critical. This viscoelastic polymer is a two..
Cure Time 180 - 240 min

@Temperature 93.3 °C
3.00 - 4.00 hour

@Temperature 200 °F
De-mold Time
Northstar Polymers MPP-A30A Polyether Prepolymer
This room-temperature-curable polyether system is one of a family of polymer systems developed by Northstar Polymers for specific demanding work environments. Urethane elastomers molded with this s..
Cure Time 180 min

@Temperature 23.0 °C
3.00 hour

@Temperature 73.4 °F
Zinc, working strength
Permabond HH131 High Temperature Threadlocker
Permabond® HH131 is a very high temperature resistant, high strength anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. It is used for ..
Cure Time 180 min

@Temperature 23.0 °C
3.00 hour

@Temperature 73.4 °F
Zinc, working strength
Permabond HM118 Anaerobic Threadlocker
Permabond® HM118 Threadlocker is an excellent general-purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Cure is fast and reliable on s..
Cure Time 180 - 360 min

@Temperature 23.0 °C
3.00 - 6.00 hour

@Temperature 73.4 °F
Zinc, working strength
Permabond HM160 Anaerobic Retaining Compound
Permabond® HM160 is a medium viscosity liquid adhesive that cures when confined between metal parts to form a tough, hard plastic. In the uncured, liquid state, the adhesive wets the metal surfaces..
Cure Time 180 min

@Temperature 23.0 °C
3.00 hour

@Temperature 73.4 °F
Zinc, working strength
Permabond HM163 Anaerobic Retainer
Permabond® HM163 is a medium viscosity, thixotropic anaerobic retaining compound that cures when confined between metal parts to form a tough bond. It has been specifically formulated to provide a ..
Cure Time 180 min

@Temperature 23.0 °C
3.00 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond LH050 Anaerobic Threadsealant
Permabond® LH050 pipe sealant with PTFE is a general purpose pipe sealant that provides instant air pressure seal up to 1000 psi with limited hand tightening. After cure, the sealing capability is ..
Cure Time 180 - 360 min

@Temperature 23.0 °C
3.00 - 6.00 hour

@Temperature 73.4 °F
Brass, working strength
Permabond LH150 Anaerobic Threadsealant
Permabond® LH150 Pipe Sealant with PTFE is designed for sealing and locking tapered metal pipe threads and fittings. It is ideal for stainless steel and other passive metals. Instant sealing of up ..
Cure Time 180 min

@Temperature 23.0 °C
3.00 hour

@Temperature 73.4 °F
M10 steel, working strength
Permabond LM012 Anaerobic Threadsealant
Permabond® LM012 is an unfilled, medium viscosity anaerobic adhesive. Its major benefit as related to other pipe sealants is that it is an unfilled resin that is compatible with hydraulic fluids. I..
Cure Time 180 min

@Temperature 23.0 °C
3.00 hour

@Temperature 73.4 °F
Aluminum, handling strength
Permabond MH199 Anaerobic Gasketmaker
Permabond® MH199 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets, thereby offering po..
Cure Time 180 - 240 min

@Temperature 66.0 °C
3.00 - 4.00 hour

@Temperature 151 °F
Full
Lord Adhesives Thermosetâ„¢ UR-329 Two Component Urethane Potting Compound
Lord UR-329 is a flexible, two-component, room temperature curing, urethane, encapsulating compound. UR-329 maintains low hardness and modulus over a wide temperature range, which imparts minimal st..
Cure Time 180 min

@Temperature 100 °C
3.00 hour

@Temperature 212 °F
Momentive Performance Materials TSE3221 Flowable, Heat Cured One Component Silicone Adhesive
TSE 3221 is a one-component, flowable, heat curing adhesive which is translucent in color and offers primerless adhesion to a wide variety of substrates. This product requires an elevated temperatur..
Cure Time 180 - 240 min

@Temperature 121 °C
3.00 - 4.00 hour

@Temperature 250 °F
second, Post Curing 350°F
Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation
Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offer..
Cure Time 180 - 240 min

@Temperature 121 - 149 °C
3.00 - 4.00 hour

@Temperature 250 - 300 °F
Master Bond EP45HTND-2 Chemically Resistant, Non-Drip Epoxy
Description: Master Bond EP45HTND-2 is a two component epoxy system for high performance bonding, sealing and coating. It is used for applications requiring solid temperature resistance and capable ..
Cure Time 180 - 240 min

@Temperature 121 - 149 °C
3.00 - 4.00 hour

@Temperature 250 - 300 °F
Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System
Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr..
Cure Time 180 - 240 min

@Temperature 65.6 °C
3.00 - 4.00 hour

@Temperature 150 °F
Master Bond EP76M-1R Nickel Conductive Epoxy Adhesive
Description: Master Bond Polymer System EP76M-1R is a two component, nickel filled, electrically conductive adhesive for high performance bonding formulated to cure at room temperature or more rapid..
Cure Time 180 min

@Temperature 100 °C
3.00 hour

@Temperature 212 °F
Tra-Con Tra-Bond 872-7TN1 Flexible Thixotropic Epoxy Adhesive
TRA-BOND 872-7TN1 is a flexible thixotropic epoxy. The high viscosity and long worklife make this material easy to handle. Also, the high thermal conductivity makes this product ideal for electronic..
Cure Time 180 - 300 min

@Temperature 23.9 °C
3.00 - 5.00 hour

@Temperature 75.0 °F
Master Bond EP21LSCL-1 Two Component, Room Temperature Curing Epoxy Resin
Product Description: Master Bond Polymer System EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring optical clarity as well as non-yellowing properties. This system can be used..
Cure Time 180 - 240 min

@Temperature 93.3 °C
3.00 - 4.00 hour

@Temperature 200 °F
Master Bond EP21TDC-7 Highly Flexible Two Component Epoxy System
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or mor..
Cure Time 180 min

@Temperature 70.0 °C
3.00 hour

@Temperature 158 °F
Tra-Con Tra-Bond 9349 Room Temperature Cure Flexible Epoxy Adhesive
TRA-BOND 9349 epoxy adhesive is a flexible, two part, room temperature curing system with high peel and sheer strengths. TRA-BOND 9349 is excellent for bonding many metals and woods, most plastics a..
Cure Time 180 min

@Temperature 29.0 °C
3.00 hour

@Temperature 84.2 °F
Overcoat End
Chesterton ARC S7 High Temperature & Chemical Resistant Novolac Vinyl Ester Coating
Description: ARC S7 is a low VOC, epoxy novolac vinyl ester based coating intended for high temperature exposures in chemically aggressive applications where the risk for thermal cycling may be pres..
Cure Time 180 min

@Temperature 150 °C
3.00 hour

@Temperature 302 °F
Cytec (Conap) FR-1080 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time 180 - 300 min

@Temperature 60.0 °C
3.00 - 5.00 hour

@Temperature 140 °F
Cytec (Conap) FR-1274 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time 180 min

@Temperature 60.0 °C
3.00 hour

@Temperature 140 °F
Cytec Conathane® CC-1195 (Conap) Polyurethane Two-component Dielectric Conformal Coating
Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time 180 min

@Temperature 80.0 °C
3.00 hour

@Temperature 176 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other..
Cure Time 180 min

@Temperature 80.0 °C
3.00 hour

@Temperature 176 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy
Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Cure Time 180 min

@Temperature 65.0 °C
3.00 hour

@Temperature 149 °F
Epoxyset Epoxibond EB-106 Unfilled Epoxy Adhesive
A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
Cure Time 180 min

@Temperature 65.0 °C
3.00 hour

@Temperature 149 °F
Epoxyset Epoxibond EB-107LP-1 Unfilled Epoxy Adhesive
A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
Cure Time 180 min

@Temperature 75.0 °C
3.00 hour

@Temperature 167 °F
Dry to handle, at 50% humidity and 75°C
Blue River Coatings Hydro-Gloss 2-Part Polyurethane Top Coat
BLUE RIVER COATINGS HYDRO-GLOSS 2-PART POLYURETHANE TOPCOAT is a water dispersible polyisocyanate coating. HYDRO-GLOSS provides outstanding coverage, excellent durability, and ease of application as..
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