Songhan Plastic Technology Co.,Ltd.

Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Filled/Reinforced Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Tra-Duct
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive.pdf
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Material Notes:
TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of silver filled epoxy is free of solvents and copper or carbon additives. It develops strong durable electrically and thermally conducting bonds and coatings between a number of materials such as metals, ceramics, glass and plastic laminates. TRA- DUCT 2956 cures at room temperature, which makes it extremely useful for bonding heat sensitive components where hot-soldering is impractical. Other common uses include the assembly and repair of electrical modules, printed circuits, wave guides, flat cable and high frequency shields. It is an excellent product for dot dispensing through needles as small as 6 mils. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 2.40 g/cc
2.40 g/cc
Viscosity 145000 cP

@Temperature 25.0 °C
145000 cP

@Temperature 77.0 °F
After mixing
Mechanical Properties Metric English Comments
Hardness, Shore D 80
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, alum to alum, 2 min @ 150°C
6.89 MPa
1000 psi
Lap shear, alum to alum, 5 min @ 100°C
6.89 MPa
1000 psi
Lap shear, alum to alum, 72 hrs @ 25°C
Thermal Properties Metric English Comments
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 175 °C
347 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Glass Transition Temp, Tg 47.0 °C
117 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 0.00010 ohm-cm
0.00010 ohm-cm
cured 72 hrs @ 25°C
0.00020 ohm-cm
0.00020 ohm-cm
cured 5 min @ 100°C
0.00050 ohm-cm
0.00050 ohm-cm
cured 2 min @ 150°C
Processing Properties Metric English Comments
Cure Time 2.00 min

@Temperature 150 °C
0.0333 hour

@Temperature 302 °F
5760 min

@Temperature 25.0 °C
96.0 hour

@Temperature 77.0 °F
Pot Life 720 min
720 min
Descriptive Properties Value Comments
Color Silver
Mix Ratio, parts by weight 100/6
Thixotropic Index 3.9
5 rpm/50 rpm
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