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Polymer Property : Thermal Conductivity = 1.50 W/m-K Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate a variety of semic..
Thermal Conductivity 1.50 - 4.69 W/m-K

@Temperature 50.0 - 50.0 °C
10.4 - 32.5 BTU-in/hr-ft²-°F

@Temperature 122 - 122 °F
Average value: 1.94 W/m-K Grade Count:4
Overview of materials for Silicone, Molded, Glass Fiber Filled
This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
Thermal Conductivity 1.50 - 4.69 W/m-K

@Pressure 30.0 - 30.0 MPa
10.4 - 32.5 BTU-in/hr-ft²-°F

@Pressure 4350 - 4350 psi
Average value: 1.94 W/m-K Grade Count:4
Overview of materials for Silicone, Molded, Glass Fiber Filled
This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
Thermal Conductivity 1.50 - 4.69 W/m-K

@Temperature 50.0 - 50.0 °C
10.4 - 32.5 BTU-in/hr-ft²-°F

@Temperature 122 - 122 °F
Average value: 2.08 W/m-K Grade Count:4
Overview of materials for Silicone Rubber
This property data is a summary of similar materials in the MatWeb database for the category "Silicone Rubber". Each property range of values reported is minimum and maximum values of appropriate Ma..
Thermal Conductivity 1.50 - 4.69 W/m-K

@Pressure 30.0 - 30.0 MPa
10.4 - 32.5 BTU-in/hr-ft²-°F

@Pressure 4350 - 4350 psi
Average value: 2.08 W/m-K Grade Count:4
Overview of materials for Silicone Rubber
This property data is a summary of similar materials in the MatWeb database for the category "Silicone Rubber". Each property range of values reported is minimum and maximum values of appropriate Ma..
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
HOT-DISK || 60x60x3 mm
Lehmann & Voss LUVOCOM® 1301/XCF/30 N PPS, linear, with carbon fiber
Applications: Automotive industry, textile-and office machinery, medical- and precision engineering.High-strength and stiff parts with low creep.Electrically conductive, suitable for continuous disc..
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
70°C for 1,000 hrs; JIS-R-2618
Fujipoly Industries Sarcon® 25G-Td Thin-Film GR-TD
Sarcon 25G-Td is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
JIS-R-2618; ASTM D2326
Fujipoly Industries Sarcon® GR-d Gap Filler Pad
Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
70°C for 1,000 hrs; JIS-R-2618
Fujipoly Industries Sarcon® GR-d Gap Filler Pad
Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
70°C for 1,000 hrs; JIS-R-2618
Fujipoly Industries Sarcon® GR-Fd Gap Filler Pad
Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-Fd has a mesh embedded overall.Information provided b..
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
60°C for 1,000 hrs with 90% RH; JIS-R-2618
Fujipoly Industries Sarcon® GR-HFd Gap Filler Pad
Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-HFd has a hardened top surface and mesh embedded over..
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
JIS-R-2618; ASTM D2326
Fujipoly Industries Sarcon® GR-Hd Gap Filler Pad
Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-Hd has a hardened top surface.Information provided by..
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
70°C for 1,000 hrs; JIS-R-2618
Fujipoly Industries Sarcon® GR-Hd Gap Filler Pad
Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-Hd has a hardened top surface.Information provided by..
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
Tra-Con Tra-Duct 2916 Room Temperature Conductive Silver Epoxy Adhesive
TRA-DUCT 2916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good ele..
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive
TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur..
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive
TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
Accuratus MACOR Machinable Glass Ceramic
Macor is cast as a two phase glass. After casting, it is heat treated causing crystallization of one phase giving rise to its glass-like and ceramic-like characteristics.Key Properties of MACOR: Mac..
Thermal Conductivity 1.50 W/m-K

@Pressure 30.0 MPa,
Temperature 50.0 °C
10.4 BTU-in/hr-ft²-°F

@Pressure 4350 psi,
Temperature 122 °F
Product Property; Arlon SQA-TMS-054
Arlon Thermabond® 48A51X015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate
Description: Primerless Thermabond® Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubb..
Thermal Conductivity 1.50 W/m-K

@Temperature 20.0 - 100 °C
10.4 BTU-in/hr-ft²-°F

@Temperature 68.0 - 212 °F
Anderman Ceramics EM60P Sillimanite
Porous synthetic mullite with high thermal shock. Available as tube up to 10 ft (3 m) long with diameters 0.6" to 2.4".Information provided by Anderman Ceramics.
Thermal Conductivity >= 1.50 W/m-K
>= 10.4 BTU-in/hr-ft²-°F
COLORA
Aptek 2313-PMF Hybrid Epoxy Adhesive
Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.Production-oriented, snap-cure technology for surface mount applications-allows cure during s..
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
HOT-DISK || 60x60x3 mm
Lehmann & Voss LUVOCOM® 1301-0824 PPS, linear, with carbon fiber
Applications: Automotive industry, textile-and office machinery, medical- and precision engineering.High-strength and stiff parts with low creep.Electrically conductive, suitable for continuous disc..
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