Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | |
Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate a variety of semic.. |
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Thermal Conductivity | 1.50 - 4.69 W/m-K @Temperature 50.0 - 50.0 °C |
10.4 - 32.5 BTU-in/hr-ft²-°F @Temperature 122 - 122 °F |
Average value: 1.94 W/m-K Grade Count:4 |
Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val.. |
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Thermal Conductivity | 1.50 - 4.69 W/m-K @Pressure 30.0 - 30.0 MPa |
10.4 - 32.5 BTU-in/hr-ft²-°F @Pressure 4350 - 4350 psi |
Average value: 1.94 W/m-K Grade Count:4 |
Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val.. |
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Thermal Conductivity | 1.50 - 4.69 W/m-K @Temperature 50.0 - 50.0 °C |
10.4 - 32.5 BTU-in/hr-ft²-°F @Temperature 122 - 122 °F |
Average value: 2.08 W/m-K Grade Count:4 |
Overview of materials for Silicone Rubber This property data is a summary of similar materials in the MatWeb database for the category "Silicone Rubber". Each property range of values reported is minimum and maximum values of appropriate Ma.. |
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Thermal Conductivity | 1.50 - 4.69 W/m-K @Pressure 30.0 - 30.0 MPa |
10.4 - 32.5 BTU-in/hr-ft²-°F @Pressure 4350 - 4350 psi |
Average value: 2.08 W/m-K Grade Count:4 |
Overview of materials for Silicone Rubber This property data is a summary of similar materials in the MatWeb database for the category "Silicone Rubber". Each property range of values reported is minimum and maximum values of appropriate Ma.. |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | HOT-DISK || 60x60x3 mm |
Lehmann & Voss LUVOCOM® 1301/XCF/30 N PPS, linear, with carbon fiber Applications: Automotive industry, textile-and office machinery, medical- and precision engineering.High-strength and stiff parts with low creep.Electrically conductive, suitable for continuous disc.. |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | 70°C for 1,000 hrs; JIS-R-2618 |
Fujipoly Industries Sarcon® 25G-Td Thin-Film GR-TD Sarcon 25G-Td is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | JIS-R-2618; ASTM D2326 |
Fujipoly Industries Sarcon® GR-d Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | 70°C for 1,000 hrs; JIS-R-2618 |
Fujipoly Industries Sarcon® GR-d Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | 70°C for 1,000 hrs; JIS-R-2618 |
Fujipoly Industries Sarcon® GR-Fd Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-Fd has a mesh embedded overall.Information provided b.. |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | 60°C for 1,000 hrs with 90% RH; JIS-R-2618 |
Fujipoly Industries Sarcon® GR-HFd Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-HFd has a hardened top surface and mesh embedded over.. |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | JIS-R-2618; ASTM D2326 |
Fujipoly Industries Sarcon® GR-Hd Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-Hd has a hardened top surface.Information provided by.. |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | 70°C for 1,000 hrs; JIS-R-2618 |
Fujipoly Industries Sarcon® GR-Hd Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-Hd has a hardened top surface.Information provided by.. |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | |
Tra-Con Tra-Duct 2916 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good ele.. |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | |
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur.. |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | |
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil.. |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | |
Accuratus MACOR Machinable Glass Ceramic Macor is cast as a two phase glass. After casting, it is heat treated causing crystallization of one phase giving rise to its glass-like and ceramic-like characteristics.Key Properties of MACOR: Mac.. |
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Thermal Conductivity | 1.50 W/m-K @Pressure 30.0 MPa, Temperature 50.0 °C |
10.4 BTU-in/hr-ft²-°F @Pressure 4350 psi, Temperature 122 °F |
Product Property; Arlon SQA-TMS-054 |
Arlon Thermabond® 48A51X015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Primerless Thermabond® Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubb.. |
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Thermal Conductivity | 1.50 W/m-K @Temperature 20.0 - 100 °C |
10.4 BTU-in/hr-ft²-°F @Temperature 68.0 - 212 °F |
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Anderman Ceramics EM60P Sillimanite Porous synthetic mullite with high thermal shock. Available as tube up to 10 ft (3 m) long with diameters 0.6" to 2.4".Information provided by Anderman Ceramics. |
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Thermal Conductivity | >= 1.50 W/m-K | >= 10.4 BTU-in/hr-ft²-°F | COLORA |
Aptek 2313-PMF Hybrid Epoxy Adhesive Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.Production-oriented, snap-cure technology for surface mount applications-allows cure during s.. |
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Thermal Conductivity | 1.50 W/m-K | 10.4 BTU-in/hr-ft²-°F | HOT-DISK || 60x60x3 mm |
Lehmann & Voss LUVOCOM® 1301-0824 PPS, linear, with carbon fiber Applications: Automotive industry, textile-and office machinery, medical- and precision engineering.High-strength and stiff parts with low creep.Electrically conductive, suitable for continuous disc.. |