Polymer Property : Specific Gravity = 2.40 g/cc Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Specific Gravity	2.40 - 2.60 g/cc	2.40 - 2.60 g/cc
Novum Glass Solid Soda-lime Industrial Series Glass Microspheres Solid soda-lime glass microspheres in colorless powder form. Industrial Series Microspheres are solid glass microspheres (also referred to as soda lime glass beads, glass spheres, or microbeads) us..
Specific Gravity	2.40 - 2.60 g/cc	2.40 - 2.60 g/cc
Novum Glass Solid Soda-lime Technical Series Glass Microspheres Solid soda-lime glass microspheres in colorless powder form. Technical Series Microspheres are solid glass microspheres that have a narrow particle size distribution. Used for chromatography, colum..
Specific Gravity	2.40 - 2.60 g/cc	2.40 - 2.60 g/cc
Novum Glass Solid Soda-lime Uniform Series Glass Microspheres Solid soda-lime glass microspheres in colorless powder form. Uniform Series Microspheres are used for controlling a bond line thickness in adhesive bonding. Solid glass microspheres are used in a v..
Specific Gravity	2.40 g/cc	2.40 g/cc
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Specific Gravity	2.40 - 2.46 g/cc	2.40 - 2.46 g/cc	ASTM D 792
Karina 1000/5035-IE MBPEB White Color Concentrate Masterbatch with 50% of TIO2. Usage from 1% to 5% depending on the client need and necessity of covering.Information provided by Karina IndÃºstria e ComÃ©rcio de PlÃ¡sticos Ltda.
Specific Gravity	2.40 g/cc	2.40 g/cc	Mixed
Tra-Con Tra-Bond 293-14 Electrically Conductive Silver-Filled Epoxy Adhesive TRA-BOND 293-14 silver-filled, electrically conductive epoxy adhesive is designed to provide strong bonds to difficult-to-bond metals, such as nickel, copper, gold and solder. The stress-absorbing c..
Specific Gravity	2.40 g/cc	2.40 g/cc	Mixed
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Specific Gravity	2.40 g/cc	2.40 g/cc
Aremco AREMCOLOX™ 502-1100 (Unfired) Machinable Alumino-Silicate Good thermal and dielectric properties and can be fired to increase temperature resistance and mechanical strength. Easily machined to close tolerances. Plates, rods and bars available to 12".
Specific Gravity	2.40 g/cc	2.40 g/cc	ASTM D792
Parker Chomerics CHO-FORM 5541 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..