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Polymer Property : Volume Resistivity = 0.00020 ohm-cm Product List

Electrical Properties

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Electrical Properties Metric English Comments
Volume Resistivity 0.00020 ohm-cm
0.00020 ohm-cm
cured 2 hours at 125°C
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive
100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Volume Resistivity 0.00020 ohm-cm
0.00020 ohm-cm
cured 10 minutes at 120°C
Resin Technology Group TIGA 951 One-Part Silver Conductive Epoxy System
Cure 10 minutes at 120°CTIGA 951 is an electrically conductive, silver-filled epoxy adhesive recommended for electronic bonding and sealing applications. This one-part, smooth paste formulation of ..
Volume Resistivity 0.00020 ohm-cm
0.00020 ohm-cm
Trelleborg Emerson & Cuming Eccobond® 56C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive
Emerson & Cuming 56C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, high electrical conductivity, epoxy adhesive. Excellent thermal conductivity. Require..
Volume Resistivity 0.00020 ohm-cm
0.00020 ohm-cm
cured 2 hrs @ 125°C
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive
TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur..
Volume Resistivity 0.00020 ohm-cm
0.00020 ohm-cm
cured 5 min @ 100°C
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive
TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Volume Resistivity >= 0.00020 ohm-cm
>= 0.00020 ohm-cm
Epoxy Technology EPO-TEK® B912-8 Epoxy
Product Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot..
Volume Resistivity <= 0.00020 ohm-cm
<= 0.00020 ohm-cm
Epoxy Technology EPO-TEK® ED1021 Epoxy
Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil..
Volume Resistivity <= 0.00020 ohm-cm
<= 0.00020 ohm-cm
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy
A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f..
Volume Resistivity 0.00020 ohm-cm
0.00020 ohm-cm
Cured property; ASTM D257
Aptek 6500-PMF Electrically conductive epoxy adhesive
High purity, low outgassing, electrically conductive adhesiveAPTEK 6500-PMF is a one component, pre-mixed frozen, 100% solid, silver-filled epoxy adhesive specifically designed for microelectronic d..
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