Electrical Properties | Metric | English | Comments |
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Volume Resistivity | 0.00020 ohm-cm | 0.00020 ohm-cm | cured 2 hours at 125°C |
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol.. |
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Volume Resistivity | 0.00020 ohm-cm | 0.00020 ohm-cm | cured 10 minutes at 120°C |
Resin Technology Group TIGA 951 One-Part Silver Conductive Epoxy System Cure 10 minutes at 120°CTIGA 951 is an electrically conductive, silver-filled epoxy adhesive recommended for electronic bonding and sealing applications. This one-part, smooth paste formulation of .. |
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Volume Resistivity | 0.00020 ohm-cm | 0.00020 ohm-cm | |
Trelleborg Emerson & Cuming Eccobond® 56C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 56C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, high electrical conductivity, epoxy adhesive. Excellent thermal conductivity. Require.. |
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Volume Resistivity | 0.00020 ohm-cm | 0.00020 ohm-cm | cured 2 hrs @ 125°C |
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur.. |
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Volume Resistivity | 0.00020 ohm-cm | 0.00020 ohm-cm | cured 5 min @ 100°C |
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil.. |
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Volume Resistivity | >= 0.00020 ohm-cm | >= 0.00020 ohm-cm | |
Epoxy Technology EPO-TEK® B912-8 Epoxy Product Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot.. |
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Volume Resistivity | <= 0.00020 ohm-cm | <= 0.00020 ohm-cm | |
Epoxy Technology EPO-TEK® ED1021 Epoxy Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil.. |
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Volume Resistivity | <= 0.00020 ohm-cm | <= 0.00020 ohm-cm | |
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f.. |
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Volume Resistivity | 0.00020 ohm-cm | 0.00020 ohm-cm | Cured property; ASTM D257 |
Aptek 6500-PMF Electrically conductive epoxy adhesive High purity, low outgassing, electrically conductive adhesiveAPTEK 6500-PMF is a one component, pre-mixed frozen, 100% solid, silver-filled epoxy adhesive specifically designed for microelectronic d.. |