Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11.. |
|||
Adhesive Bond Strength | 6.89 - 19.3 MPa | 1000 - 2800 psi | Average value: 13.1 MPa Grade Count:6 |
Overview of materials for Epoxy, Cast, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Unreinforced". Each property range of values reported is minimum and maximum values of appr.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, adhesion to glass |
Tra-Con Tra-Bond 546S02 Low Viscosity UV Curable Adhesive TRA-BOND 546S02 is a low viscosity UV curable adhesive exhibiting exceptional adhesion to glass. TRA-BOND 546S02 is designed to be semi-flexible resulting in stress free bonds to glass and other sub.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 724-17 Polyurethane Adhesive TRA-BOND 724-17 premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, mylar a.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 832-5 Flexible Epoxy TRA-BOND 832-5 is a flexible two component epoxy which is intended for bonding materials with mis-matched coefficients of expansion. It exhibits flexibility associated with polyurethanes but does no.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum, 2 min @ 150°C |
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications .. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum, 5 min @ 125°C |
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications .. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | |
Trelleborg Emerson & Cuming Eccobond® 83C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 83C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveTwo component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. G.. |
|||
Adhesive Bond Strength | >= 6.89 MPa | >= 1000 psi | Shear Al/Al |
Master Bond EP30LTE-LO Dimensionally Stable Low Outgassing Two Part Epoxy Master Bond Polymer System EP30LTE-LO is a thermal shock resistant epoxy resin system with low thermal expansion properties and dimensional stability for high performance bonding, sealing and castin.. |
|||
Adhesive Bond Strength | >= 6.89 MPa | >= 1000 psi | Shear Al/Al |
Master Bond EP30QF Quartz Filled, Two Component Epoxy System Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 2129 Clear Low Viscosity Epoxy Adhesive TRA-BOND 2129 is a low viscosity epoxy adhesive recommended for industrial and electronic production, repair, small casting, coating, tooling, and rigid laminating applications where a clear system .. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, adhesion to glass, minimum |
Tra-Con Tra-Bond 546S05 Dual-Cure Acrylate TRA-BOND 546S05 is a dual cure (UV/heat) acrylate featuring excellent adhesion to glass. Ultimate Tg attained and shadowed areas cured with 15 minute exposure to 100-120°C.Information provided by T.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum, 2 hrs @ 65°C |
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum, 2 min @ 150°C |
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum, 5 min @ 100°C |
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum, 72 hrs @ 25°C |
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil.. |
|||
Adhesive Bond Strength | 6.89 - 20.7 MPa | 1000 - 3000 psi | Varies with substrates |
Loctite® Durabond® E-40FL Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli.. |
|||
Adhesive Bond Strength | 6.89 - 20.7 MPa | 1000 - 3000 psi | Varies with substrates |
Loctite® Durabond® U-05FL Urethane Adhesive Urethane AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 ap.. |
|||
Adhesive Bond Strength | 6.89 MPa @Temperature 82.2 °C |
1000 psi @Temperature 180 °F |
Aluminum-Aluminum tensile shear |
Armstrong A-2/H20 Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Black (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and .. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Clear (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and .. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has .. |
|||
Adhesive Bond Strength | >= 6.89 MPa | >= 1000 psi | Aluminum to Aluminum |
Loctite® 3883 Stencil Print Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
|||
Adhesive Bond Strength | >= 6.89 MPa | >= 1000 psi | Aluminum to Aluminum |
Loctite® 3888 Room Temperature Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
|||
Adhesive Bond Strength | >= 6.89 MPa | >= 1000 psi | Aluminum to Aluminum |
Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
|||
Adhesive Bond Strength | 6.89 - 42.1 MPa | 1000 - 6100 psi | Average value: 19.1 MPa Grade Count:7 |
Overview of materials for Epoxy, Cast, Metal Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Aluminum Filled". Each property range of values reported is minimum and maximum values of a.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro.. |
|||
Adhesive Bond Strength | >= 6.89 MPa | >= 1000 psi | Aluminum to Aluminum |
Loctite® 3880 Heat Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |