Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has .. |
|||
Adhesive Bond Strength | 6.90 MPa | 1000 psi | Aluminum, Shear; ASTM D1002 |
Permabond 930 Cyanoacrylate PERMABOND 930 is a low odor, nonfogging, nonfrosting cyanoacrylate. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesives on hot and humid days, is eliminated. The .. |
|||
Adhesive Bond Strength | 6.90 MPa | 1000 psi | Aluminum, Shear; ASTM D1002 |
Permabond 931 Cyanoacrylate PERMABOND 931 is a low odor, nonfogging, nonfrosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv.. |
|||
Adhesive Bond Strength | 6.90 MPa | 1000 psi | Aluminum, Shear; ASTM D1002 |
Permabond 932 Cyanoacrylate PERMABOND 932 is a low odor, nonfogging, nonfrosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv.. |
|||
Adhesive Bond Strength | 6.89 - 19.3 MPa | 1000 - 2800 psi | Average value: 13.1 MPa Grade Count:6 |
Overview of materials for Epoxy, Cast, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Unreinforced". Each property range of values reported is minimum and maximum values of appr.. |
|||
Adhesive Bond Strength | 6.90 MPa @Temperature 25.0 °C |
1000 psi @Temperature 77.0 °F |
Lap Shear |
Henkel Hysol EA 9203 Primer Primer enhances adhesion on poorly prepared surfaces. Requires only room temperature drying prior to bond. Use with room-temperature-curing paste adhesives.Applications: Sprayable Metal and Honeyco.. |
|||
Adhesive Bond Strength | 6.89 MPa @Temperature 23.0 °C |
1000 psi @Temperature 73.4 °F |
|
Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive Master Bond Polymer Adhesive EP21TPND is a two component polysulfide epoxy based adhesive / sealant formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Pol.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, adhesion to glass |
Tra-Con Tra-Bond 546S02 Low Viscosity UV Curable Adhesive TRA-BOND 546S02 is a low viscosity UV curable adhesive exhibiting exceptional adhesion to glass. TRA-BOND 546S02 is designed to be semi-flexible resulting in stress free bonds to glass and other sub.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 575T01 Anaerobic Adhesive TRA-BOND 575T01 is a high strength, very fast cure, single component anaerobic retaining adhesive for fiber optic terminations. This product cures when confined in the absence of air between close f.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 724-17 Polyurethane Adhesive TRA-BOND 724-17 premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, mylar a.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum, 1 hr @ 70°C |
Tra-Con Tra-Duct 2705 Room Temperature Conductive Nickel Epoxy Adhesive TRA-DUCT 2705 is an electrically conductive nickel filled epoxy adhesive recommended for electronic bonding, sealing, and EMI-RFI shielding applications. This two-part smooth paste formulation is fr.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | |
Trelleborg Emerson & Cuming Eccobond® 83C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 83C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveTwo component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. G.. |
|||
Adhesive Bond Strength | >= 6.89 MPa | >= 1000 psi | Shear Al/Al |
Master Bond EP30LTE-LO Dimensionally Stable Low Outgassing Two Part Epoxy Master Bond Polymer System EP30LTE-LO is a thermal shock resistant epoxy resin system with low thermal expansion properties and dimensional stability for high performance bonding, sealing and castin.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 2129 Clear Low Viscosity Epoxy Adhesive TRA-BOND 2129 is a low viscosity epoxy adhesive recommended for industrial and electronic production, repair, small casting, coating, tooling, and rigid laminating applications where a clear system .. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, adhesion to glass, minimum |
Tra-Con Tra-Bond 546S05 Dual-Cure Acrylate TRA-BOND 546S05 is a dual cure (UV/heat) acrylate featuring excellent adhesion to glass. Ultimate Tg attained and shadowed areas cured with 15 minute exposure to 100-120°C.Information provided by T.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum, 2 hrs @ 65°C |
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear, alum to alum, 72 hrs @ 25°C |
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil.. |
|||
Adhesive Bond Strength | 6.89 - 20.7 MPa | 1000 - 3000 psi | Varies with substrates |
Loctite® Durabond® U-05FL Urethane Adhesive Urethane AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 ap.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Al-to-Al Lap Shear; Cured 1 hr at 65ºC; ASTM D1002 |
Aptek 6516-A/B Electrically conductive epoxy adhesive General purpose, electrically conductive epoxy adhesiveAPTEK 6516-A/B is a two component, 100% solid, silver filled electrically conductive epoxy adhesive specifically designed for the attachment of.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free .. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Black (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and .. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has .. |
|||
Adhesive Bond Strength | >= 6.89 MPa | >= 1000 psi | Aluminum to Aluminum |
Loctite® 3883 Stencil Print Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
|||
Adhesive Bond Strength | >= 6.89 MPa | >= 1000 psi | Aluminum to Aluminum |
Loctite® 3888 Room Temperature Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
|||
Adhesive Bond Strength | 6.89 - 42.1 MPa | 1000 - 6100 psi | Average value: 19.1 MPa Grade Count:7 |
Overview of materials for Epoxy, Cast, Metal Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Aluminum Filled". Each property range of values reported is minimum and maximum values of a.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
|||
Adhesive Bond Strength | 6.89 MPa | 1000 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro.. |
|||
Adhesive Bond Strength | >= 6.89 MPa | >= 1000 psi | Aluminum to Aluminum |
Loctite® 3880 Heat Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
|||
Adhesive Bond Strength | 6.90 - 6.90 MPa @Temperature 121 - 121 °C |
1000 - 1000 psi @Temperature 250 - 250 °F |
Average value: 6.90 MPa Grade Count:1 |
Overview of materials for Polyimide, Thermoset Film This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Thermoset Film". Each property range of values reported is minimum and maximum values of appr.. |