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Polymer Property : Adhesive Bond Strength = 1000 psi Product List

Mechanical Properties

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Mechanical Properties Metric English Comments
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant
Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Adhesive Bond Strength 6.90 MPa
1000 psi
Aluminum, Shear; ASTM D1002
Permabond 930 Cyanoacrylate
PERMABOND 930 is a low odor, non­fogging, non­frosting cyanoacrylate. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesives on hot and humid days, is eliminated. The ..
Adhesive Bond Strength 6.90 MPa
1000 psi
Aluminum, Shear; ASTM D1002
Permabond 931 Cyanoacrylate
PERMABOND 931 is a low odor, non­fogging, non­frosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv..
Adhesive Bond Strength 6.90 MPa
1000 psi
Aluminum, Shear; ASTM D1002
Permabond 932 Cyanoacrylate
PERMABOND 932 is a low odor, non­fogging, non­frosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv..
Adhesive Bond Strength 6.89 - 19.3 MPa
1000 - 2800 psi
Average value: 13.1 MPa Grade Count:6
Overview of materials for Epoxy, Cast, Unreinforced
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Unreinforced". Each property range of values reported is minimum and maximum values of appr..
Adhesive Bond Strength 6.90 MPa

@Temperature 25.0 °C
1000 psi

@Temperature 77.0 °F
Lap Shear
Henkel Hysol EA 9203 Primer
Primer enhances adhesion on poorly prepared surfaces. Requires only room temperature drying prior to bond. Use with room-temperature-curing paste adhesives.Applications: Sprayable Metal and Honeyco..
Adhesive Bond Strength 6.89 MPa

@Temperature 23.0 °C
1000 psi

@Temperature 73.4 °F
Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide epoxy based adhesive / sealant formulated to cure at room temperature or more rapidly at elevated temperatures.  Master Bond Pol..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, adhesion to glass
Tra-Con Tra-Bond 546S02 Low Viscosity UV Curable Adhesive
TRA-BOND 546S02 is a low viscosity UV curable adhesive exhibiting exceptional adhesion to glass. TRA-BOND 546S02 is designed to be semi-flexible resulting in stress free bonds to glass and other sub..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, alum to alum
Tra-Con Tra-Bond 575T01 Anaerobic Adhesive
TRA-BOND 575T01 is a high strength, very fast cure, single component anaerobic retaining adhesive for fiber optic terminations. This product cures when confined in the absence of air between close f..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, alum to alum
Tra-Con Tra-Bond 724-17 Polyurethane Adhesive
TRA-BOND 724-17 premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, mylar a..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, alum to alum, 1 hr @ 70°C
Tra-Con Tra-Duct 2705 Room Temperature Conductive Nickel Epoxy Adhesive
TRA-DUCT 2705 is an electrically conductive nickel filled epoxy adhesive recommended for electronic bonding, sealing, and EMI-RFI shielding applications. This two-part smooth paste formulation is fr..
Adhesive Bond Strength 6.89 MPa
1000 psi
Trelleborg Emerson & Cuming Eccobond® 83C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive
Emerson & Cuming 83C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveTwo component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. G..
Adhesive Bond Strength >= 6.89 MPa
>= 1000 psi
Shear Al/Al
Master Bond EP30LTE-LO Dimensionally Stable Low Outgassing Two Part Epoxy
Master Bond Polymer System EP30LTE-LO is a thermal shock resistant epoxy resin system with low thermal expansion properties and dimensional stability for high performance bonding, sealing and castin..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, alum to alum
Tra-Con Tra-Bond 2129 Clear Low Viscosity Epoxy Adhesive
TRA-BOND 2129 is a low viscosity epoxy adhesive recommended for industrial and electronic production, repair, small casting, coating, tooling, and rigid laminating applications where a clear system ..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, adhesion to glass, minimum
Tra-Con Tra-Bond 546S05 Dual-Cure Acrylate
TRA-BOND 546S05 is a dual cure (UV/heat) acrylate featuring excellent adhesion to glass. Ultimate Tg attained and shadowed areas cured with 15 minute exposure to 100-120°C.Information provided by T..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, alum to alum, 2 hrs @ 65°C
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive
TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, alum to alum, 72 hrs @ 25°C
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive
TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Adhesive Bond Strength 6.89 - 20.7 MPa
1000 - 3000 psi
Varies with substrates
Loctite® Durabond® U-05FL Urethane Adhesive
Urethane AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 ap..
Adhesive Bond Strength 6.89 MPa
1000 psi
Al-to-Al Lap Shear; Cured 1 hr at 65ºC; ASTM D1002
Aptek 6516-A/B Electrically conductive epoxy adhesive
General purpose, electrically conductive epoxy adhesiveAPTEK 6516-A/B is a two component, 100% solid, silver filled electrically conductive epoxy adhesive specifically designed for the attachment of..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1026R Rubber Modified Epoxy Adhesive
Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free ..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP1300 Black (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Adhesive Bond Strength >= 6.89 MPa
>= 1000 psi
Aluminum to Aluminum
Loctite® 3883 Stencil Print Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Adhesive Bond Strength >= 6.89 MPa
>= 1000 psi
Aluminum to Aluminum
Loctite® 3888 Room Temperature Cure Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Adhesive Bond Strength 6.89 - 42.1 MPa
1000 - 6100 psi
Average value: 19.1 MPa Grade Count:7
Overview of materials for Epoxy, Cast, Metal Filled
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Aluminum Filled". Each property range of values reported is minimum and maximum values of a..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant
Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin
Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro..
Adhesive Bond Strength >= 6.89 MPa
>= 1000 psi
Aluminum to Aluminum
Loctite® 3880 Heat Cure Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Adhesive Bond Strength 6.90 - 6.90 MPa

@Temperature 121 - 121 °C
1000 - 1000 psi

@Temperature 250 - 250 °F
Average value: 6.90 MPa Grade Count:1
Overview of materials for Polyimide, Thermoset Film
This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Thermoset Film". Each property range of values reported is minimum and maximum values of appr..
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