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Polymer Property : CTE, linear = 27.2 µin/in-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
Parker Chomerics CHO-BOND 584-208 Conductive Adhesive
Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the m..
CTE, linear 49.0 µm/m-°C
27.2 µin/in-°F
Resinlab® EP950G Gray Aluminum Filled Rubber Modified Epoxy
EP950G Gray is an aluminum filled one part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated temperature. It is a medium paste-like viscosi..
CTE, linear 49.0 - 75.0 µm/m-°C

@Temperature 40.0 - 130 °C
27.2 - 41.7 µin/in-°F

@Temperature 104 - 266 °F
Average value: 62.0 µm/m-°C Grade Count:2
Overview of materials for Phenolic, Novolac, Mineral/Glass Filled
This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral/Glass Filled". Each property range of values reported is minimum and maximum ..
CTE, linear 49.0 µm/m-°C

@Temperature -30.0 - 100 °C
27.2 µin/in-°F

@Temperature -22.0 - 212 °F
ASTM D696
LyondellBasell Hifaxâ„¢ CB259 Thermoplastic Polyolefin Elastomer
Description: Hifaxâ„¢ CB259 medium high melt flow, 1,600 MPa flexural modulus, low CLTE, paintable, mineral-filled thermoplastic elastomeric olefin (TEO) resin has a very good balance of impact r..
CTE, linear 49.0 µm/m-°C

@Temperature 40.0 - 130 °C
27.2 µin/in-°F

@Temperature 104 - 266 °F
TMA; ASTM E831
Plenco 3509 Phenolic, Granular, Injection Molded
PLENCO 03509 is a mineral and flock filled phenolic molding compound offering excellent electrical properties, dimensional stability, and improved heat resistance. UL recognized under component file..
CTE, linear 49.0 µm/m-°C

@Temperature 40.0 - 130 °C
27.2 µin/in-°F

@Temperature 104 - 266 °F
TMA; ASTM E831
Plenco 6015 Phenolic, Briquette, Transfer Molded
PLENCO 06015 is a glass and mineral filled phenolic molding compound offering improved mechanical strength, dimensional stability and excellent electrical properties. 06015 is available in black.Inf..
CTE, linear 49.0 µm/m-°C
27.2 µin/in-°F
ASTM D696
Unitika M1030E PA6, Dry
Nano composite nylonInformation provided by Unitika Ltd.
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Duct 2907 Silver-Filled Epoxy Adhesive
TRA-DUCT 2907 is an electrically conducting silver-filled medium viscosity epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical an..
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive
TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications ..
CTE, linear 49.0 µm/m-°C

@Temperature -30.0 - 80.0 °C
27.2 µin/in-°F

@Temperature -22.0 - 176 °F
Borealis Method
Borealis Daplen™ EF261AI Polypropylene TPO Compound
Daplen™ EF261AI is a 20 % mineral filled polypropylene compound intended for injection molding. This material has an excellent balance between impact strength and stiffness and is easy to process...
CTE, linear 49.0 µm/m-°C

@Temperature 40.0 - 130 °C
27.2 µin/in-°F

@Temperature 104 - 266 °F
TMA; ASTM E831
Plenco 4002 Phenolic, Granular, Injection Molded
PLENCO 04002 is a heat resistant, mineral filled phenolic molding compound offering excellent mechanical strength and dimensional stability at elevated temperatures. UL recognized under component fi..
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive
TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive
TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur..
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive
TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
CTE, linear 49.0 µm/m-°C
27.2 µin/in-°F
Hexcel® HexPly® F650 Bismaleimide Resin
HexPly® F650 is a bismaleimide resin that cures via an additional/free radical mechanism resulting in a cross-linked thermoset system with no condensation by-products. HexPly® F650 was developed b..
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Covestro Bayflex® 110-50 Polyurethane Elastomeric RIM, 15% Mineral Filled, MDI-based 2-Component Liquid System
Mineral filler is RRIMGLOS® 10013. 0.125 in. thickness. RIM = Reaction Injection MoldingInformation provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialSc..
CTE, linear 49.0 µm/m-°C
27.2 µin/in-°F
E831
Ensinger Tecapeek® ST PolyEtherKetoneEtherKetoneKetone, Unreinforced
TECAPEEK® ST is a multipurpose semi-crystaline material from the polyaryletherketone family based on PEKEKK that features improved mechanical properties at higher temperatures. The benefits of TECA..
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Devcon Wear Guard (High Temp) Epoxy
Abrasion-Resistant SystemComments: PuttyData provided by Ellsworth Adhesives.
CTE, linear 49.0 µm/m-°C
27.2 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® H61 Unfilled Epoxy Adhesive
Material Description: A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of E..
CTE, linear 49.0 µm/m-°C
27.2 µin/in-°F
Epoxyset Epoxiohm EO-21 Electrically Conductive Epoxy Adhesive
EO-21 is a two part, silver filled high electrical conductivity epoxy adhesive. It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and..
CTE, linear 49.0 µm/m-°C
27.2 µin/in-°F
Epoxyset Epoxiohm EO-23M Electrically Conductive Epoxy Adhesive
EO-23M is an electrically conductive, low viscosity silver-filled epoxy adhesive. Used for hybrid / micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.I..
CTE, linear 49.0 µm/m-°C

@Temperature 50.0 - 410 °C
27.2 µin/in-°F

@Temperature 122 - 770 °F
Dow SiLK™ Y 120 Semiconductor Dielectric Resin
SiLK™ Y 120 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow
CTE, linear 49.0 µm/m-°C

@Temperature 50.0 - 410 °C
27.2 µin/in-°F

@Temperature 122 - 770 °F
Dow SiLK™ Y 250 Semiconductor Dielectric Resin
SiLK™ Y 250 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow
CTE, linear 49.0 µm/m-°C

@Temperature 50.0 - 410 °C
27.2 µin/in-°F

@Temperature 122 - 770 °F
Dow SiLK™ Y 80 Semiconductor Dielectric Resin
SiLK™ Y 80 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow
CTE, linear 49.0 µm/m-°C

@Temperature -40.0 - 82.0 °C
27.2 µin/in-°F

@Temperature -40.0 - 180 °F
Ascend Performance Materials VYDYNE® R220 Nylon, Mineral Reinforced
Typical property data. VYDYNE is a registered trademark of Solutia Inc.
CTE, linear 49.0 µm/m-°C

@Temperature 0.000 - 80.0 °C
27.2 µin/in-°F

@Temperature 32.0 - 176 °F
3M Scotch-Weld™ 2214 Hi-Dense Epoxy Adhesive
3M™ Scotch-Weld™ Adhesive 2214 Hi-Dense is a deareted version of Scotch-Weld adhesive 2214 regular for use where a very dense, void free bondline is required. One part 250°F (121°C) curing 100% ..
CTE, linear 49.0 µm/m-°C

@Temperature 0.000 - 80.0 °C
27.2 µin/in-°F

@Temperature 32.0 - 176 °F
3M Scotch-Weld™ 2214 Regular Epoxy Adhesive
3M™ Scotch-Weld™ Adhesive 2214 Regular is an aluminum filled general purpose product for use in applications where high strength bonds are needed in a temperature range of -53-121°C.One part 250°..
CTE, linear 49.0 µm/m-°C
27.2 µin/in-°F
ASTM E831-93
Saint-Gobain Meldin® 2021 Bearing
General Notes on Meldin 2000 Series Bearing Products:For High-Temperature, Close-Tolerance Applications. Able to withstand temperatures of 600°F with excursions to 900°F, the Medlin 2000 Series ca..
CTE, linear 49.0 - 137 µm/m-°C
27.2 - 76.1 µin/in-°F
Average value: 75.3 µm/m-°C Grade Count:10
Overview of materials for Thermoset Polyurethane, Elastomer, Glass Filled
This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Polyurethane, Elastomer, Glass Filled". Each property range of values reported is minimum and ..
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