Resinlab® EP1115 Clear Unfilled Epoxy Adhesive

Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and bases and most organic solvents. This product gives better water and temperature resistance than standard 5 minute epoxy. It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side by side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 2 – 4 hours with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly. 30 minutes at 60°C t o 10 minutes at 100°C is typical.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.