Polymer Property : Compressive Modulus = 300 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Modulus	2.07 GPa	300 ksi	TM R050-38
Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting ..
Compressive Modulus	2.07 GPa	300 ksi	ASTM D695
Quadrant EPP Quadrant 1000 LSP PC Extruded Unfilled Polycarbonate
Compressive Modulus	2.07 GPa	300 ksi	ASTM D695
Quadrant EPP Quadrant PC 1000 Extruded, Unfilled, Polycarbonate (ASTM Product Data Sheet)
Compressive Modulus	2.07 GPa	300 ksi	Average value: 2.07 GPa Grade Count:3
Overview of materials for Polycarbonate, Extruded This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate, Extruded". Each property range of values reported is minimum and maximum values of approp..
Compressive Modulus	2.07 GPa	300 ksi	ASTM D695
Saint-Gobain MeldinÂ® 7021 Direct Formed Graphite Filled Polyimide Finished parts and basic shapes made from 15% by weight graphite filled polyimide material for applications high wear resistance, good thermal oxidative stability, and high temperature resistance. ..
Compressive Modulus	2.07 GPa	300 ksi	ASTM D695
Quadrant EPP Quadrant LSG PC (ASTM Product Data Sheet) Data provided by Quadrant Engineering Plastic Products.
Compressive Modulus	2.07 GPa	300 ksi	TM R050-38
Resinlab® EP1195 Flame Retardant Epoxy Casting Resin Resinlab™ EP1195 is a low viscosity, fast gelling, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File # E1..
Compressive Modulus	2.07 GPa	300 ksi	TM R050-38
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula..
Compressive Modulus	2.07 GPa	300 ksi	TM R050-38
Resinlab® EP965 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting ..
Compressive Modulus	2.07 GPa	300 ksi	TM R050-38
Resinlab® EP1115 Clear Unfilled Epoxy Adhesive Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..
Compressive Modulus	2.07 GPa	300 ksi	TM R050-38
Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro..
Compressive Modulus	2.07 GPa	300 ksi	TM R050-38
Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th..