Polymer Property : Pot Life = 8.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11..
Pot Life	8.0 min @Temperature 21.1 °C	8.0 min @Temperature 70.0 °F	Working Time
Protective Coating PC-Fahrenheit™ High Temperature Epoxy PC-Fahrenheit™ is a hand moldable putty epoxy designed for quick emergency-type repairs formulated for increased temperatures. PC-Fahrenheit™ can be expected to outperform other putties at high te..
Pot Life	8.0 - 12 min	8.0 - 12 min
Resin Technology Group 2TN Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	8.0 - 12 min	8.0 - 12 min
Resin Technology Group 2TN Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1294 Mineral Filled, Flame Retardant Epoxy Syntactic Foam Resinlab™ EP1294 is a two part mineral filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-exti..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Pot Life	8.0 - 12 min	8.0 - 12 min	Time before parts must be mated
Lord Adhesives 648 Low Odor, Low Flammability, Non Sag, Metal Use Acrylic Adhesive Lord Adhesives 648 Low Odor, Low Flammability, Non Sag, Metal Use Acrylic Adhesive
Pot Life	8.0 - 15 min	8.0 - 15 min	Time before parts must be mated
Lord Adhesives 7542C Two-Component Urethane Adhesive Lord Urethane AdhesivesLordÂ® one- and two-part urethane adhesives provide superior bonds with minimal surface preparation for today's high performance thermosets and thermoplastics. They offe..
Pot Life	8.0 - 12 min	8.0 - 12 min
ITW Plexus Plexusâ„¢ MA320 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Excellent low temperature and toughness properties.Information provided by Illinois Tool Works.
Pot Life	8.0 - 10 min @Temperature 24.0 °C	8.0 - 10 min @Temperature 75.2 °F	1 lb. mass
BCC Products BC 8165 Urethane Casting BC 8165 is a low viscosity, rapid setting, rigid urethane compound. This system will cure quickly to a hard, tough, impact resistant casting. BC 8165 is non-sensitive to moisture after cure and wil..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1199 Black Unfilled Epoxy Adhesive Resinlab™ EP1199 Black is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1115 Clear Unfilled Epoxy Adhesive Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1199 Clear Unfilled Epoxy Adhesive Resinlab™ EP1199 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..