Polymer Property : CTE, linear = 200 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	200 µm/m-°C @Temperature 20.0 °C	111 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; Perkin Elmer TMS-2
Aptek 6108-PMF Epoxy Coating/Encapsulant High temperature, rigid, electrical/electronic coating or encapsulant. Provides excellent environmental protection for continuous exposure to 220°C.Information provided by Aptek Laboratories, Inc.
CTE, linear	200 µm/m-°C @Temperature 20.0 °C	111 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; Perkin Elmer TMS-2
Aptek 6108-PMF Epoxy Encapsulant and/or Potting Compound High temperature, rigid, electrical/electronic coating or encapsulant. Provides excellent environmental protection for continuous exposure to 220°C. Also can be used as a high temperature wire varn..
CTE, linear	200 µm/m-°C @Temperature -50.0 - 110 °C	111 µin/in-°F @Temperature -58.0 - 230 °F
3M Scotch-Weld™ DP110 Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP110 Translucent and Gray are two-part epoxy adhesive which combine a fast cure with flexibilityInformation provided by 3M
CTE, linear	200 µm/m-°C @Temperature >=55.0 °C	111 µin/in-°F @Temperature >=131 °F	above Tg
Resinlab® EP1115 Clear Unfilled Epoxy Adhesive Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..