Physical Properties | Metric | English | Comments |
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Viscosity | 50000 - 70000 cP | 50000 - 70000 cP | B |
ITW Plexus Plexusâ„¢ MA1020 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works. |
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Viscosity | 50000 - 70000 cP | 50000 - 70000 cP | B |
ITW Plexus Plexusâ„¢ MA1021 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low shrinkage.Information provided by Illinois Tool Works. |
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Viscosity | 50000 - 70000 cP | 50000 - 70000 cP | B |
ITW Plexus Plexusâ„¢ MA920 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low odor, short open time.Information provided by Illinois Tool Works. |
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Viscosity | 50000 cP @Temperature 23.0 °C |
50000 cP @Temperature 73.4 °F |
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Momentive Performance Materials TSE397 One Component RTV Adhesive Sealant/Coating, Clear/White TSE392, TSE397 and TSE399 adhesive sealants/coatings are one component RTV’s that cure quickly by reacting with atmospheric moisture forming a soft dielectric silicone rubber. These materials i.. |
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Viscosity | 50000 - 110000 cP | 50000 - 110000 cP | Part B |
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation .. |
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Viscosity | 50000 - 60000 cP @Temperature 23.0 °C |
50000 - 60000 cP @Temperature 73.4 °F |
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Master Bond EP21HT High Temperature Resistant Two Component Epoxy Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durabl.. |
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Viscosity | 50000 cP | 50000 cP | available as EP21TP |
Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive Master Bond Polymer Adhesive EP21TPND is a two component polysulfide epoxy based adhesive / sealant formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Pol.. |
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Viscosity | 50000 - 60000 cP | 50000 - 60000 cP | |
Master Bond EP45HTMED Epoxy Resists Radiation and Steam Sterilization Description: Master Bond Polymer System EP45HTMED is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the .. |
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Viscosity | 50000 cP @Temperature 25.0 °C |
50000 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Bond F156 Optically Opaque Epoxy Adhesive TRA-BOND F156 is a black, solvent-free thixotropic epoxy system recommended for high quality photographic industry bonding, laminating, production and repair applications where a room-temperature cu.. |
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Viscosity | 50000 cP | 50000 cP | Mixed |
Tra-Con Tra-Bond GA47-2LV Instrument Adhesive TRA-BOND GA47-2LV low viscosity adhesive is designed for guidance instrument applications. This adhesive exhibits excellent compatibility with conventional gyro flotation fluids. TRA-BOND GA47-2LV a.. |
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Viscosity | 50000 - 70000 cP | 50000 - 70000 cP | uncured coating |
Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin.. |
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Viscosity | 50000 cP @Temperature 25.0 °C |
50000 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Stycast® 2762/17M-1 Two-Component Epoxy High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har.. |
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Viscosity | 50000 - 60000 cP @Temperature 23.0 °C |
50000 - 60000 cP @Temperature 73.4 °F |
5 rpm |
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr.. |
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Viscosity | >= 50000 cP | >= 50000 cP | |
Epoxyset Epoxiohm EO-30FST Electrically Conductive Epoxy Adhesive EO-30-FST is two part, fast cure, silver filled, and high electrical conductivity epoxy adhesive. Both components are silver filled permitting a simple 1:1 mix ratio by weight. It has smooth creamy .. |
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Viscosity | 50000 cP | 50000 cP | |
Cotronics Duralco™ 127 400°F (200°C) Graphite Filled Epoxy One component, graphite filled epoxy for low cost production applications. Can be used with automatic dispensing equipment. |
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Viscosity | 50000 cP | 50000 cP | "A" component |
ACC QLE 1020 QSI Quantum Silicones 45 Durometer Clear, Addition Cure Elastomer for Coating QLE 1020 is a 100% silicone solids elastomer designed for fabric or cloth coating applications. This two-component system offers a tough coating with excellent adhesion and fast cure.Key Features: .. |
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Viscosity | 50000 cP | 50000 cP | Base |
ACC QM 140 QSI Quantum Silicones 40 Durometer Condensation Cured Moldmaking Material QM 140 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent cho.. |
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Viscosity | 50000 cP | 50000 cP | Base |
ACC QM 245 QSI Quantum Silicones 45 Durometer Addition Cure Moldmaking Material QM 245 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th.. |
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Viscosity | 50000 cP | 50000 cP | catalyzed with QM 270B |
ACC QM 270 QSI Quantum Silicones 70 Durometer Addition Cure Moldmaking Material QM 270 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties, good shelf-life stability, excellent physical properties and resin .. |
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Viscosity | 50000 - 90000 cP | 50000 - 90000 cP | |
Aremco Ceramabond™ 503 High Temperature Ceramic Adhesive/Paste, Alumina Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and.. |
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Viscosity | 50000 cP | 50000 cP | |
ACC QMSkin 30 Specialist Molding 2-Part Condensation Cure Part of the Amber Chemical Group. Data provided by manufacturer. |