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Polymer Property : Viscosity = 50000 cP Product List

Physical Properties

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Physical Properties Metric English Comments
Viscosity 50000 - 70000 cP
50000 - 70000 cP
B
ITW Plexus Plexusâ„¢ MA1020 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works.
Viscosity 50000 - 70000 cP
50000 - 70000 cP
B
ITW Plexus Plexusâ„¢ MA1021 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low shrinkage.Information provided by Illinois Tool Works.
Viscosity 50000 - 70000 cP
50000 - 70000 cP
B
ITW Plexus Plexusâ„¢ MA920 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low odor, short open time.Information provided by Illinois Tool Works.
Viscosity 50000 cP

@Temperature 23.0 °C
50000 cP

@Temperature 73.4 °F
Momentive Performance Materials TSE397 One Component RTV Adhesive Sealant/Coating, Clear/White
TSE392, TSE397 and TSE399 adhesive sealants/coatings are one component RTV’s that cure quickly by reacting with atmospheric moisture forming a soft dielectric silicone rubber. These materials i..
Viscosity 50000 - 110000 cP
50000 - 110000 cP
Part B
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive
Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
Viscosity 50000 - 60000 cP

@Temperature 23.0 °C
50000 - 60000 cP

@Temperature 73.4 °F
Master Bond EP21HT High Temperature Resistant Two Component Epoxy
Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durabl..
Viscosity 50000 cP
50000 cP
available as EP21TP
Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide epoxy based adhesive / sealant formulated to cure at room temperature or more rapidly at elevated temperatures.  Master Bond Pol..
Viscosity 50000 - 60000 cP
50000 - 60000 cP
Master Bond EP45HTMED Epoxy Resists Radiation and Steam Sterilization
Description: Master Bond Polymer System EP45HTMED is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the ..
Viscosity 50000 cP

@Temperature 25.0 °C
50000 cP

@Temperature 77.0 °F
After mixing
Tra-Con Tra-Bond F156 Optically Opaque Epoxy Adhesive
TRA-BOND F156 is a black, solvent-free thixotropic epoxy system recommended for high quality photographic industry bonding, laminating, production and repair applications where a room-temperature cu..
Viscosity 50000 cP
50000 cP
Mixed
Tra-Con Tra-Bond GA47-2LV Instrument Adhesive
TRA-BOND GA47-2LV low viscosity adhesive is designed for guidance instrument applications. This adhesive exhibits excellent compatibility with conventional gyro flotation fluids. TRA-BOND GA47-2LV a..
Viscosity 50000 - 70000 cP
50000 - 70000 cP
uncured coating
Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System
Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin..
Viscosity 50000 cP

@Temperature 25.0 °C
50000 cP

@Temperature 77.0 °F
Mixed
Trelleborg Emerson & Cuming Stycast® 2762/17M-1 Two-Component Epoxy High Service Temp Encapsulant
Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har..
Viscosity 50000 - 60000 cP

@Temperature 23.0 °C
50000 - 60000 cP

@Temperature 73.4 °F
5 rpm
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy
Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Viscosity >= 50000 cP
>= 50000 cP
Epoxyset Epoxiohm EO-30FST Electrically Conductive Epoxy Adhesive
EO-30-FST is two part, fast cure, silver filled, and high electrical conductivity epoxy adhesive. Both components are silver filled permitting a simple 1:1 mix ratio by weight. It has smooth creamy ..
Viscosity 50000 cP
50000 cP
Cotronics Duralco™ 127 400°F (200°C) Graphite Filled Epoxy
One component, graphite filled epoxy for low cost production applications. Can be used with automatic dispensing equipment.
Viscosity 50000 cP
50000 cP
"A" component
ACC QLE 1020 QSI Quantum Silicones 45 Durometer Clear, Addition Cure Elastomer for Coating
QLE 1020 is a 100% silicone solids elastomer designed for fabric or cloth coating applications. This two-component system offers a tough coating with excellent adhesion and fast cure.Key Features: ..
Viscosity 50000 cP
50000 cP
Base
ACC QM 140 QSI Quantum Silicones 40 Durometer Condensation Cured Moldmaking Material
QM 140 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent cho..
Viscosity 50000 cP
50000 cP
Base
ACC QM 245 QSI Quantum Silicones 45 Durometer Addition Cure Moldmaking Material
QM 245 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th..
Viscosity 50000 cP
50000 cP
catalyzed with QM 270B
ACC QM 270 QSI Quantum Silicones 70 Durometer Addition Cure Moldmaking Material
QM 270 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties, good shelf-life stability, excellent physical properties and resin ..
Viscosity 50000 - 90000 cP
50000 - 90000 cP
Aremco Ceramabond™ 503 High Temperature Ceramic Adhesive/Paste, Alumina Filled
Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Viscosity 50000 cP
50000 cP
ACC QMSkin 30 Specialist Molding 2-Part Condensation Cure
Part of the Amber Chemical Group. Data provided by manufacturer.
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