Polymer Property : Pot Life = 12 min Product List

Processing Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Processing Properties	Metric	English	Comments
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11..
Pot Life	8.0 - 12 min	8.0 - 12 min
Resin Technology Group 2TN Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	8.0 - 12 min	8.0 - 12 min
Resin Technology Group 2TN Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1294 Mineral Filled, Flame Retardant Epoxy Syntactic Foam Resinlab™ EP1294 is a two part mineral filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-exti..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Pot Life	8.0 - 12 min	8.0 - 12 min	Time before parts must be mated
Lord Adhesives 648 Low Odor, Low Flammability, Non Sag, Metal Use Acrylic Adhesive Lord Adhesives 648 Low Odor, Low Flammability, Non Sag, Metal Use Acrylic Adhesive
Pot Life	8.0 - 12 min	8.0 - 12 min
ITW Plexus Plexusâ„¢ MA320 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Excellent low temperature and toughness properties.Information provided by Illinois Tool Works.
Pot Life	6.0 - 12 min @Temperature 24.0 °C	6.0 - 12 min @Temperature 75.2 °F	1lb mass
BCC Products BC 4544 Polyester Carvable Wood Filler This polyester resin base compound is easy to use, sets in minutes and can be sanded or carved almost immediately. Acts like wood yet exhibits no grain problems. BC4544 Wood Filler can be carved, sa..
Pot Life	10 - 12 min @Temperature 24.0 °C	10 - 12 min @Temperature 75.2 °F	12-14 minutes gel time, ASTM-D-2471, 1/2lb mass
BCC Products DP-11-88 Urethane Adhesive DP-11-88 is a medium viscosity quick setting easy to use urethane adhesive. This system was specifically designed to bond together the MB2001/MB3000 Model/Tooling Board to create desired dimensions ..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1199 Black Unfilled Epoxy Adhesive Resinlab™ EP1199 Black is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1115 Clear Unfilled Epoxy Adhesive Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..
Pot Life	8.0 - 12 min	8.0 - 12 min	Mass: 50g; TM R050-19
Resinlab® EP1199 Clear Unfilled Epoxy Adhesive Resinlab™ EP1199 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..