Songhan Plastic Technology Co.,Ltd.

Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive.pdf
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Material Notes:
Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. It can cure at ambient temperatures or more rapidly at elevated temperatures. However, to optimize its properties it is recommended to add heat when curing. A highly effective cure schedule is overnight at room temperature followed by a few hours at 150-200°F. EP30M4LV resists water, acids, bases, fuels and oils, along with many strong solvents. Some of the potent chemicals it can resist include Skydrol, xylene, 70% sulfuric acid, 98% sulfuric acid, 50% sodium hydroxide and bleach. This compound is 100% reactive and does not contain any solvents or other volatiles. EP30M4LV offers excellent adhesion to both similar and dissimilar substrates including metals, glass, ceramics and many plastics. It is also noteworthy for its superior electrical insulation properties. It has a low viscosity and excellent flow, along with lower exotherm, which can be used for a variety of moderately sized potting and encapsulation applications. EP30M4LV is serviceable over the wide temperature range of -80°F to +250°F. The color of Part A is clear and Part B is amber. Master Bond Polymer System EP30M4LV is widely used in the aerospace, OEM, electronic, electrical and electro-optic industries. Product Advantages: Non-critical mix ratio: 100 to 60 by weight. Low viscosity, good flow; well suited for potting and encapsulation. Superior chemical resistance. Outstanding electrical insulation properties. High bond strength to a wide variety of substrates. Excellent physical strength properties.Information provided by MasterBond®
Physical Properties Metric English Comments
Viscosity 350 - 700 cP
350 - 700 cP
Part B
10000 - 14000 cP
10000 - 14000 cP
Part A
Mechanical Properties Metric English Comments
Hardness, Shore D 75 - 85
75 - 85
Tensile Strength at Break >= 41.4 MPa
>= 6000 psi
Tensile Modulus 1.72 - 2.07 GPa
250 - 300 ksi
Compressive Strength >= 55.2 MPa
>= 8000 psi
Shear Strength >= 13.8 MPa
>= 2000 psi
Bond, Al to Al
Thermal Properties Metric English Comments
CTE, linear 50.0 - 55.0 µm/m-°C
27.8 - 30.6 µin/in-°F
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -62.2 °C
-80.0 °F
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+14 ohm-cm
>= 1.00e+14 ohm-cm
Dielectric Constant 3.65

@Frequency 60.0 Hz

@Frequency 60.0 Hz
Processing Properties Metric English Comments
Cure Time 180 - 240 min

@Temperature 23.9 °C
3.00 - 4.00 hour

@Temperature 75.0 °F
1440 - 2880 min

@Temperature 93.3 °C
24.0 - 48.0 hour

@Temperature 200 °F
Pot Life 75 - 120 min
75 - 120 min
100 gram batch
Shelf Life 12.0 Month

@Temperature 23.9 °C
12.0 Month

@Temperature 75.0 °F
in original unopened container
Descriptive Properties Value Comments
Mixing Ratio (A to B) 100:60
by weight
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