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Polymer Property : Cure Time = 2880 min Product List

Processing Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Processing Properties Metric English Comments
Cure Time 1440 - 2880 min

@Temperature 25.0 °C
24.0 - 48.0 hour

@Temperature 77.0 °F
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System
Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U..
Cure Time 2160 - 2880 min

@Temperature 25.0 °C
36.0 - 48.0 hour

@Temperature 77.0 °F
Permit Normal Usage
Lord Adhesives Aeroglaze® Z306 Absorptive Polyurethane
Aeroglaze® Z306 absorptive polyurethane coating is primarily for applications to substrates used in space operations. These operations include those where coatings must exhibit low outgassing cha..
Cure Time 1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Master Bond EP21AR Acid Resistant Two Component Epoxy
Master Bond EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealant with outstanding acid as well as excellent overall chemical resistance. E..
Cure Time 1440 - 2880 min

@Temperature 22.2 °C
24.0 - 48.0 hour

@Temperature 72.0 °F
Master Bond EP21ARHTND Two component epoxy adhesive, sealant, coating and encapsulating system
Product Description: Master Bond EP21ARHTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a convenient 100 to 50 mix ratio by weight and is formulat..
Cure Time 1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Master Bond EP21FRSPLV Flame Resistant Two Component Epoxy
Master Bond Polymer System EP21FRSPLV is a two component, room temperature curable, flame resistant compound for potting, encapsulating and casting. EP21FRSPLV has a one to one mix ratio, by weight...
Cure Time 1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Master Bond EP21HT High Temperature Resistant Two Component Epoxy
Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durabl..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond EP21LV35Med Two Component, Flexible USP Class VI Epoxy System
Master Bond Polymer System EP21LV3/5Med is a two part, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readil..
Cure Time 1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Master Bond EP21ND Non Drip Room Temperature Curing Epoxy System
Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties. EP21ND can be mixed by weight or volume and is available in a ..
Cure Time 1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Master Bond EP21TDC Toughened, Shock Resistant Two Component Epoxy System
Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one ..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy
Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength..
Cure Time 2160 - 2880 min

@Temperature 23.0 °C
36.0 - 48.0 hour

@Temperature 73.4 °F
Master Bond EP30D-7 Flexibilized, Abrasion Resistant Epoxy System
Master Bond Polymer System EP30D-7 is a versatile two component flexibilized, urethane-modified epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sea..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond EP30P Epoxy Bonds Glass, Polycarbonates and Acrylics
Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is for..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond EP38CL Adhesive Features Toughness and Durability
Description: Master Bond EP38CL is a lower viscosity, optically clear two component epoxy system for high performance bonding, coating, sealing and small encapsulations, featuring toughness and dura..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond EP41S-1HT Solvent Resistant Adhesive, Sealant and Coating
Description: Master Bond EP41S-1HT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a 100 to 30 mix ratio by weight and is formulated to..
Cure Time 1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Master Bond EP75-1 Graphite Filled Electrically Conductive Epoxy System
Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more ..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy
Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
Cure Time 1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Master Bond Mastersil 151 Two Component Low Viscosity Silicone Compound
Master Bond MasterSil 151 is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151 is an addition cured system and does not require exposure..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond MasterSil 151Med Medical Grade Silicone Potting Compound
Description: Master Bond MasterSil 151Med is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151Med is an addition cured system and does no..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System
Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat..
Cure Time 1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy
Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at r..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive
Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System
Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at ..
Cure Time 1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Master Bond Supreme 11HT-LO Adhesive and Sealant Serviceable to +400°F
Description: Master Bond Polymer System Supreme 11HT-LO is an easy to use two part epoxy adhesive/sealant combining both high shear and high peel strengths along with a relatively fast cure at room ..
Cure Time 1440 - 2880 min

@Temperature 25.0 °C
24.0 - 48.0 hour

@Temperature 77.0 °F
Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time 1440 - 2880 min

@Temperature 25.0 °C
24.0 - 48.0 hour

@Temperature 77.0 °F
Cytec (Conap) FR-1274 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time 1440 - 2880 min

@Temperature 25.0 °C
24.0 - 48.0 hour

@Temperature 77.0 °F
Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive
EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information..
Cure Time 1440 - 2880 min

@Temperature 93.3 °C
24.0 - 48.0 hour

@Temperature 200 °F
Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive
Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig..
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