Processing Properties | Metric | English | Comments |
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Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
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Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U.. |
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Cure Time | 2160 - 2880 min @Temperature 25.0 °C |
36.0 - 48.0 hour @Temperature 77.0 °F |
Permit Normal Usage |
Lord Adhesives Aeroglaze® Z306 Absorptive Polyurethane Aeroglaze® Z306 absorptive polyurethane coating is primarily for applications to substrates used in space operations. These operations include those where coatings must exhibit low outgassing cha.. |
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Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
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Master Bond EP21AR Acid Resistant Two Component Epoxy Master Bond EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealant with outstanding acid as well as excellent overall chemical resistance. E.. |
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Cure Time | 1440 - 2880 min @Temperature 22.2 °C |
24.0 - 48.0 hour @Temperature 72.0 °F |
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Master Bond EP21ARHTND Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a convenient 100 to 50 mix ratio by weight and is formulat.. |
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Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
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Master Bond EP21FRSPLV Flame Resistant Two Component Epoxy Master Bond Polymer System EP21FRSPLV is a two component, room temperature curable, flame resistant compound for potting, encapsulating and casting. EP21FRSPLV has a one to one mix ratio, by weight... |
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Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
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Master Bond EP21HT High Temperature Resistant Two Component Epoxy Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durabl.. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond EP21LV35Med Two Component, Flexible USP Class VI Epoxy System Master Bond Polymer System EP21LV3/5Med is a two part, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readil.. |
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Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
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Master Bond EP21ND Non Drip Room Temperature Curing Epoxy System Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties. EP21ND can be mixed by weight or volume and is available in a .. |
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Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
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Master Bond EP21TDC Toughened, Shock Resistant Two Component Epoxy System Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one .. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength.. |
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Cure Time | 2160 - 2880 min @Temperature 23.0 °C |
36.0 - 48.0 hour @Temperature 73.4 °F |
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Master Bond EP30D-7 Flexibilized, Abrasion Resistant Epoxy System Master Bond Polymer System EP30D-7 is a versatile two component flexibilized, urethane-modified epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sea.. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond EP30P Epoxy Bonds Glass, Polycarbonates and Acrylics Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is for.. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond EP38CL Adhesive Features Toughness and Durability Description: Master Bond EP38CL is a lower viscosity, optically clear two component epoxy system for high performance bonding, coating, sealing and small encapsulations, featuring toughness and dura.. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond EP41S-1HT Solvent Resistant Adhesive, Sealant and Coating Description: Master Bond EP41S-1HT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a 100 to 30 mix ratio by weight and is formulated to.. |
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Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
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Master Bond EP75-1 Graphite Filled Electrically Conductive Epoxy System Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more .. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or .. |
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Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
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Master Bond Mastersil 151 Two Component Low Viscosity Silicone Compound Master Bond MasterSil 151 is a two component, low viscosity
silicone compound for high performance potting and
encapsulation. MasterSil 151 is an addition cured system and does not require exposure.. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond MasterSil 151Med Medical Grade Silicone Potting Compound Description: Master Bond MasterSil 151Med is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151Med is an addition cured system and does no.. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat.. |
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Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
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Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at r.. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap.. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at .. |
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Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
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Master Bond Supreme 11HT-LO Adhesive and Sealant Serviceable to +400°F Description: Master Bond Polymer System Supreme 11HT-LO is an easy to use two part epoxy adhesive/sealant combining both high shear and high peel strengths along with a relatively fast cure at room .. |
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Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
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Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
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Cytec (Conap) FR-1274 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
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Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information.. |
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Cure Time | 1440 - 2880 min @Temperature 93.3 °C |
24.0 - 48.0 hour @Temperature 200 °F |
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Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig.. |