Polymer Property : Viscosity = 10000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	10000 - 20000 cP @Temperature 25.0 °C	10000 - 20000 cP @Temperature 77.0 °F	Uncured
Permabond TA459 Toughened Acrylic Adhesive Permabond TA459 is a structural acrylic adhesive designed primarily for bonding metals, ferrites, ceramics and some thermoplastics. This product was specifically designed to be non-corrosive to sens..
Viscosity	10000 - 26000 cP	10000 - 26000 cP
Lord Adhesives 202 Semi-Flexible, Fast Cure, Medium Viscosity Acrylic Adhesive Lord 200 SeriesLord 200 Series Acrylic Adhesives bond minimally prepared or unprepared surfaces. They offer excellent adhesion to unprepared metals, ceramic magnets and plastics. Viscosities range f..
Viscosity	10000 - 80000 cP	10000 - 80000 cP	Hardener
Lord Adhesives 660 White, Non Sag, Fast Set for FRP Acrylic Adhesive Lord Adhesives 660 White, Non Sag, Fast Set for FRP Acrylic AdhesiveLord 660 Acrylic Adhesive bonds FRP (fiber-reinforced plastics) with minimal surface preparation. Lord 660 can cross-bond FRP to m..
Viscosity	10000 cP @Temperature 25.0 Â°C	10000 cP @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ MD-150 Conductive Adhesive LORD Thermosetâ„¢ MD-150 silver-filled conductive adhesive offers excellent electrical and thermal conductivity. It is designed for use with automated dispensing, stamping and screen-printing app..
Viscosity	10000 - 15000 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	10000 - 15000 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2020322D6 Platinum Polymeric Ink C2020322D6 is a screen printable Platinum ink designed for printing working electrodes in electrochemical sensor applications. The paste can be used to detect H2O2, is suitable for developing biose..
Viscosity	10000 cP @Shear Rate 100 1/s, Temperature 25.0 Â°C	10000 cP @Shear Rate 100 1/s, Temperature 77.0 Â°F	Haake VT550 cone and plate viscometer (PK1.1Â°)
Gwent Electronic Materials C2031105D2 Palladium Ink Palladium Ink C2031105D2 is an ink formulated for screen printing for use on Fuel Cells. It is suitable for application onto Solid Oxide Fuel Cells.The ink has been made at a ready to use viscosity..
Viscosity	10000 cP	10000 cP	Mixed Viscosity
ITW Devcon Rubber Repair / Castable Urethane Cable Cast FR, Black Information provided by ITW Devcon
Viscosity	10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 25.0 Â°C	10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 77.0 Â°F	Bohlin CVO 100
Gwent Electronic Materials C2110127D3 Nanocopper based Paste This product is a nanocopper based paste for screen printing that is compatible with low temperature substrates such as paper. Produced using nanoparticles of negligible oxide content resulting in a..
Viscosity	10000 - 20000 cP	10000 - 20000 cP	B
ITW Plexus Plexusâ„¢ MA555 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low exotherm adhesive able to be used 1" thick.Information provided by Illinois Tool Works.
Viscosity	10000 - 30000 cP @Temperature 40.0 Â°C	10000 - 30000 cP @Temperature 104 Â°F
Taiwan PU Corporation PTMG CPU-100L Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Viscosity	10000 - 15000 cP	10000 - 15000 cP	30% solid in Anone
Taiwan Sheen Soon SheenthaneÂ® A8521 TPU for Ink Thermoplastic polyurethane elastomer for ink. Hydrolysis resistance gradeAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen..
Viscosity	10000 cP @Temperature 25.0 Â°C	10000 cP @Temperature 77.0 Â°F
Silikony Polskie Polsil OM 10000 Methyl Silicone Fluid The methyl silicone fluids are liquid organic silicone polymers, including inorganic elements (Si-O bond, as in quartz, glass or sand) and inorganic elements (methyl groups) in one molecule. This gi..
Viscosity	<= 10000 cP	<= 10000 cP	LVT #3 SP @ 20 rpm 60 sec; RP-0659
Solvay MIRACAREÂ® LAC-394 Surfactant Description: A free-flowing high active surfactant system, which offers excellent cleansing, foaming and viscosity building characteristics in shampoos, body washes, bath products and liquid soaps.I..
Viscosity	10000 - 14000 cP	10000 - 14000 cP	Part A
Master Bond EP30-3LO Highly versatile, two part epoxy system for bonding, coating, sealing and casting Master Bond EP30-3LO is a two component epoxy system featuring a combination of optical clarity and light transmission, good glass transition temperature (Tg), great chemical resistance along with p..
Viscosity	10000 cP @Temperature 25.0 °C	10000 cP @Temperature 77.0 °F	Mixed
Trelleborg Emerson & Cuming EP578 Adhesive Density matched blue adhesive for use with EP678, TB610 and TB620.All information provided by Trelleborg Emerson & Cuming
Viscosity	10000 cP @Temperature 25.0 °C	10000 cP @Temperature 77.0 °F
Cytec (Conap) FR-1210 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Viscosity	10000 cP @Temperature 25.0 °C	10000 cP @Temperature 77.0 °F
Cytec (Conap) FR-1272 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Viscosity	10000 - 14000 cP @Temperature 23.0 °C	10000 - 14000 cP @Temperature 73.4 °F	20 rpm
Epoxy Technology EPO-TEK® 730 Unfilled Black General and Structural Grade Epoxy Material Description: A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, xray device, fil..
Viscosity	10000 cP	10000 cP	T
Dymax 628 Structural Adhesive Structural Adhesives for Rugged Bonding, Sealing, Tacking and Potting in SecondsMulti-Cure® 600 Series products are rapid setting adhesives that cure by UV light, activator or heat. These products ..
Viscosity	10000 cP	10000 cP	T
Dymax 630 Structural Adhesive Structural Adhesives for Rugged Bonding, Sealing, Tacking and Potting in SecondsMulti-Cure® 600 Series products are rapid setting adhesives that cure by UV light, activator or heat. These products ..
Viscosity	10000 cP	10000 cP	Base
ACC QM 107 QSI Quantum Silicones 7 Durometer Condensation Cure Moldmaking Material QM 107 is a two component, room temperature condensation cure silicone material. The cured rubber is very soft, has excellent mechanical properties and good shelf-life stability. This material is us..
Viscosity	10000 cP	10000 cP	catalyzed with QM 230B
ACC QM 230 QSI Quantum Silicones 30 Durometer Addition Cure Moldmaking Material QM 230 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th..
Viscosity	10000 - 20000 cP	10000 - 20000 cP
Aremco Pyro-Paint™ 634-AS1 High Temperature Refractory Coating This alumina-silica based advanced coating is rated for continuous service temperatures up to 2300 °F. Provides excellent adhesion to ceramic fiber blankets, modules and boards and resists wetting ..
Viscosity	10000 cP	10000 cP	Part A, RVT, #5, 2.5 rpm; TM R050-12
Resinlab® EP1026HP Epoxy Adhesive Resinlab™ EP1026HP is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product gives good resistance to water salt spray, inorgan..
Viscosity	10000 cP	10000 cP	Mixed; TM R050-12
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Black (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Viscosity	10000 cP	10000 cP	Mixed; TM R050-12
Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Clear (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Viscosity	10000 - 35000 cP	10000 - 35000 cP	Thixotropic
Loctite® 549 Thread Sealant Thread SealersLoctite® Liquid Thread Sealants seal and secure metal pipes and fittings, filling the space between threaded metal parts, and hardening to prevent leakage. Designed for low and high p..