Polymer Property : Pot Life = 75 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	75 min	75 min
Huntsman HY 9130 Polyamide Approx. H+ equivalent weight 95. Mix Ratio with GY 6010 is 50.Comments/Applications: Low viscosity polyamidoamine for solvent free systems. Good mechanical properties. Adhesives, sealants, floor..
Pot Life	75 - 90 min	75 - 90 min	100 gram mass
Master Bond EP21TDCN Two Component Nickel Conductive Epoxy Adhesive Product Description: Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or ..
Pot Life	75 - 90 min	75 - 90 min	100 gram mass
Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Pot Life	75 - 90 min	75 - 90 min	50 gram mass
Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Pot Life	75 - 90 min	75 - 90 min	100 gram batch
Master Bond EP76M-1R Nickel Conductive Epoxy Adhesive Description: Master Bond Polymer System EP76M-1R is a two component, nickel filled, electrically conductive adhesive for high performance bonding formulated to cure at room temperature or more rapid..
Pot Life	75 - 90 min	75 - 90 min	50 gm mass
Master Bond EP79FL Two Component Silver Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP79FL is a two component, silver-coated nickel, electrically conductive system for high performance bonding and sealing. Its most salient features are its high flexibilit..
Pot Life	75 min	75 min
Tra-Con Tra-Bond 2147 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND 2147 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting..
Pot Life	75 min	75 min
Tra-Con Tra-Bond FS163 Medium Viscosity Epoxy/Polyamide Adhesive TRA-BOND FS163 is a medium viscosity polyamide/epoxy adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are r..
Pot Life	75 min	75 min
Tra-Con Tra-Bond FS227 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND FS227 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wettin..
Pot Life	75 min @Temperature 25.0 °C	75 min @Temperature 77.0 °F
Trelleborg Emerson & Cuming EP578 Adhesive Density matched blue adhesive for use with EP678, TB610 and TB620.All information provided by Trelleborg Emerson & Cuming
Pot Life	75 - 120 min	75 - 120 min	100 gram batch
Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals Description: Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..
Pot Life	75 min	75 min
Henkel Hysol EA 9396 Paste Adhesive System Two-part, low viscosity, unfilled version of Hysol EA 9394. Qualified to BMS 8-301.Applications: Structural Repair Low Viscosity Wet Lay-Up Composite Bonding
Pot Life	75 - 120 min	75 - 120 min	100 gram batch
Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig..