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Polymer Property : CTE, linear = 21.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 21.0 µm/m-°C @Temperature 20.0 °C |
11.7 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Covestro Petlon® 4630 Semi-Crystalline PET, 30% Glass Fiber
(discontinued **) Characteristics: Flame Retardant: Electrical Properties, High Heat and Chemical ResistanceApplications: Connectors, Relays, Switches, Automotive (Under Hood), AppliancesProcessing: Injection Molding.. |
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| CTE, linear | 21.0 - 54.0 µm/m-°C | 11.7 - 30.0 µin/in-°F | Average value: 36.5 µm/m-°C Grade Count:18 |
| Overview of materials for Acrylonitrile Butadiene Styrene (ABS), 20% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Acrylonitrile Butadiene Styrene (ABS), 20% Glass Fiber Filled". Specific grades with glass content betwe.. |
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| CTE, linear | 21.0 - 450 µm/m-°C | 11.7 - 250 µin/in-°F | Average value: 57.6 µm/m-°C Grade Count:24 |
| Overview of materials for Polycarbonate/Polybutylene Terephthalate (PBT) Blend, Glass Filled This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate/Polybutylene Terephthalate (PBT) Blend, Glass Filled". Each property range of values repor.. |
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| CTE, linear | 21.0 - 30.0 µm/m-°C | 11.7 - 16.7 µin/in-°F | Average value: 22.7 µm/m-°C Grade Count:7 |
| Overview of materials for Epoxy, Molded, Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Molded, Mineral Filled". Each property range of values reported is minimum and maximum values of .. |
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| CTE, linear | 21.0 µm/m-°C @Temperature 20.0 °C |
11.7 µin/in-°F @Temperature 68.0 °F |
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| Cookson Group Plaskon® 3100LS Mineral Filled Conventional Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A semiconductor grade encapsulant suitable for a wide range of applications ranging from small SOICs to moderate lead count DIPs... |
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| CTE, linear | 21.0 µm/m-°C @Temperature 20.0 °C |
11.7 µin/in-°F @Temperature 68.0 °F |
|
| Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability, excellent moldability, good release characteristics, low flash and rapid cure. This compound i.. |
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| CTE, linear | 21.0 µm/m-°C @Temperature 20.0 °C |
11.7 µin/in-°F @Temperature 68.0 °F |
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| Cookson Group Plaskon® 3300SH Mineral Filled Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability, excellent moldability, good release characteristics and low flash. This compound is especially.. |
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| CTE, linear | 21.0 µm/m-°C @Temperature 20.0 °C |
11.7 µin/in-°F @Temperature 68.0 °F |
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| Cookson Group Plaskon® PPF-165A Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A conventional molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. Lo.. |
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| CTE, linear | 21.0 - 82.0 µm/m-°C @Temperature 40.0 - 130 °C |
11.7 - 45.6 µin/in-°F @Temperature 104 - 266 °F |
Average value: 50.5 µm/m-°C Grade Count:19 |
| Overview of materials for Phenolic, Novolac, Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral Filled". Each property range of values reported is minimum and maximum values.. |
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| CTE, linear | 21.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
11.7 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
| Industrial Laminates/Norplex NP193P Synthetic Fabric Description: 17 oz. aramid and "soft glass" fibers are combined to make a fabric that is stronger than pure aramid and less abrasive than glass fabrics. This material is impregnated with a high temp.. |
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| CTE, linear | 21.0 µm/m-°C | 11.7 µin/in-°F | Alpha 1 |
| Lord Adhesives Thermosetâ„¢ ME-531 Underfill Encapsulant LORD Thermosetâ„¢ ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and wit.. |
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| CTE, linear | 21.0 µm/m-°C | 11.7 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-0706 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts; impact resistance.Dynamic stressed parts at high movement velocity.Ch.. |
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| CTE, linear | 21.0 - 42.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
11.7 - 23.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL HFG300 PPE+PS (Asia Pacific) PPE+PS GF30% filled, FR V-0 |
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| CTE, linear | 21.0 - 33.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
11.7 - 18.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL HM4025H PPE+PS (Asia Pacific) 40% GF/MF filled FR PPE/PS blend, high flow |
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| CTE, linear | 21.0 - 43.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
11.7 - 23.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL NC220 PPE+HIPS (Asia Pacific) |
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| CTE, linear | 21.0 - 24.0 µm/m-°C | 11.7 - 13.3 µin/in-°F | |
| Master Bond EP21SC-1 Two Component Epoxy Resin System Product Description: Master Bond Polymer System EP21SC-1 is a two component epoxy system featuring abrasion resistance. This high performance compound utilizes silicon carbide as a filler material a.. |
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| CTE, linear | 21.0 µm/m-°C @Temperature 20.0 °C |
11.7 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Plastics Group Polifil® GFABS-20 20% Glass-Reinforced Acrylonitrile-Butadiene Styrene (ABS) Polifil® GFABS series compounds combine the most desirable properties of both components - allowing for enhanced processability and toughness together with the stiffness of glass.Applications: Fire.. |
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| CTE, linear | 21.0 µm/m-°C @Temperature 40.0 - 130 °C |
11.7 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 6343 Phenolic, Granular, Transfer Molded PLENCO 06343 is a mica reinforced phenolic molding compound, offering for a low power factor, low electrical losses, and good electrical properties after long exposures to high humidity. UL recogniz.. |
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| CTE, linear | 21.0 µm/m-°C | 11.7 µin/in-°F | ASTM D696 |
| Unitika UG-100-20 Engineering Plastic Excellent creep resistance, dimensional stability at high temperatureInformation provided by Unitika Ltd. |
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| CTE, linear | 21.0 µm/m-°C @Temperature 20.0 °C |
11.7 µin/in-°F @Temperature 68.0 °F |
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| Williams Advanced Alloys WS243 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| CTE, linear | 21.0 µm/m-°C | 11.7 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil.. |
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| CTE, linear | 21.0 µm/m-°C | 11.7 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OE138 Two Component Epoxy Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in.. |
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| CTE, linear | 21.0 µm/m-°C @Temperature 20.0 °C |
11.7 µin/in-°F @Temperature 68.0 °F |
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| AIM 96.5Sn/3.5Ag Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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| CTE, linear | 21.0 µm/m-°C | 11.7 µin/in-°F | Below glass transition temp; ASTM D696 |
| Performance Polymers IPS II PPL-C1050 PEKK (Polyetherketoneketone) Linear Extrusion Grade Amber pellets; neat resinInformation provided by Infinite Polymer System II. |
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| CTE, linear | 21.0 µm/m-°C | 11.7 µin/in-°F | Below glass transition temp; ASTM D696 |
| Performance Polymers IPS II PPL-C4050 PEKK (Polyetherketoneketone) Linear Molding Grade Amber pellets; neat resinInformation provided by Infinite Polymer System II. |
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| CTE, linear | 21.0 - 77.0 µm/m-°C | 11.7 - 42.8 µin/in-°F | Average value: 39.7 µm/m-°C Grade Count:3 |
| Overview of materials for PEKK, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "PEKK, Unreinforced". Each property range of values reported is minimum and maximum values of appropriate.. |
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| CTE, linear | 21.0 µm/m-°C @Temperature 20.0 °C |
11.7 µin/in-°F @Temperature 68.0 °F |
|
| Cookson Group Plaskon® 3300S Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, flame retardant, novolac hardened epoxy molding compound designed to provide hermeticity protection exceeding that .. |
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