Cookson Group Plaskon® 3300SH Mineral Filled Epoxy Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy, Molded, Mineral Filled , Filled/Reinforced Thermoset
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 3300SH Mineral Filled Epoxy Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability, excellent moldability, good release characteristics and low flash. This compound is especially formulated for improved hermeticity protection with high temperature compatibility and low stress.

Physical Properties	Metric	English	Comments
Density	1.86 g/cc	0.0672 lb/in³
Spiral Flow	78.0 - 102 cm	30.7 - 40.2 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	75	75
Tensile Strength, Ultimate	83.0 MPa	12000 psi
Flexural Strength	124 MPa	18000 psi
Flexural Modulus	16.0 GPa	2320 ksi

Thermal Properties	Metric	English
CTE, linear	21.0 µm/m-°C @Temperature 20.0 °C	11.7 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	69.0 µm/m-°C @Temperature 20.0 °C	38.3 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	155 °C	311 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0020 @Frequency 1000 Hz	0.0020 @Frequency 1000 Hz
Arc Resistance	18 sec	18 sec

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 190 °C	338 - 374 °F	Molding temperature

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