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- Lord Adhesives Thermosetâ„¢ ME-531 Underfill Encapsulant
Lord Adhesives Thermosetâ„¢ ME-531 Underfill Encapsulant
| Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
| Manufacturer | Lord Adhesives |
| Trade Name | Thermoset™ |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Lord Adhesives Thermosetâ„¢ ME-531 Underfill Encapsulant.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
LORD Thermoset™ ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.Thermoset ME-531 encapsulant is engineered to withstand 260°C peak reflow temperatures of lead-free solders.All information provided by Lord.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.71 g/cc | 1.71 g/cc | |
| Water Absorption | <= 0.50 % | <= 0.50 % | |
| Brookfield Viscosity | 4000 cP @Temperature 25.0 °C |
4000 cP @Temperature 77.0 °F |
Spindle CP40 @ 5rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Modulus of Elasticity | 6.00 GPa | 870 ksi | Storage |
| Shear Strength | 62.0 MPa | 8990 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 21.0 µm/m-°C | 11.7 µin/in-°F | Alpha 1 |
| 85.0 µm/m-°C | 47.2 µin/in-°F | Alpha 2 | |
| Glass Transition Temp, Tg | 140 °C | 284 °F | TMA |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Potassium, K | <= 0.00010 % | <= 0.00010 % | |
| Sodium, Na | <= 0.00050 % | <= 0.00050 % |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+15 ohm-cm @Temperature 25.0 °C |
1.00e+15 ohm-cm @Temperature 77.0 °F |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 15.0 min @Temperature 165 °C |
0.250 hour @Temperature 329 °F |
|
| 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
||
| Pot Life | 960 min @Temperature 25.0 °C |
960 min @Temperature 77.0 °F |
|
| Gel Time | 6.00 min @Temperature 150 °C |
6.00 min @Temperature 302 °F |
|
| Shelf Life | 6.00 Month @Temperature -40.0 °C |
6.00 Month @Temperature -40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Appearance | Black | |
| Chloride (%) | < 0.001 | |
| Consistency | Low-Viscosity Liquid |
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