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Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy, Molded, Mineral Filled , Filled/Reinforced Thermoset
Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability, excellent moldability, good release characteristics, low flash and rapid cure. This compound is especially formulated for automated molding equipment.
Physical Properties Metric English Comments
Density 1.86 g/cc
0.0672 lb/in³
Spiral Flow 38.0 cm
15.0 in
177°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 75
75
Tensile Strength, Ultimate 83.0 MPa
12000 psi
Flexural Strength 124 MPa
18000 psi
Thermal Properties Metric English Comments
CTE, linear 21.0 µm/m-°C

@Temperature 20.0 °C
11.7 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 90.0 µm/m-°C

@Temperature 20.0 °C
50.0 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 155 °C
311 °F
Flammability, UL94 V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
Electrical Properties Metric English Comments
Dielectric Constant 3.8

@Frequency 1000 Hz
3.8

@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm
406 kV/in
Dissipation Factor 0.0020

@Frequency 1000 Hz
0.0020

@Frequency 1000 Hz
Arc Resistance 180 sec
180 sec
Processing Properties Metric English Comments
Processing Temperature 170 - 190 °C
338 - 374 °F
Molding temperature
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