Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy

Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Low viscosity version of EPO-TEK® H31.Advantages & Application Notes: Bright /shiny silver provides high reflectance, especially good for enhancing LED overall brightness.Rheology described as pourable paste:Allows for high volume dispensing, wafer-level stamping, and pin transfer methods of application.It is capable of spray coating or paint brush coating. Suggested applications:Semiconductor: die attach chips onto lead-frames for JEDEC Level III and II packaging. Adhesion to Ag-spot leadframe.Hybrids: GaAs and Si die attach, adhesion to Au-plated chips, general electrical contacts for ceramic circuits, substrate attach to ground package.Opto-electronic: single LED packaging in TO-cans, LED arrays on PCB or substrate, adhesion to ITO in LCDs, and sensor device/OEM instrumentation.PCB/General: EMI or Rf shielding of electronicsAvailable in several different viscosity versions. Information Provided by Epoxy Technology