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Polymer Property : Viscosity = 2000 cP Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 2000 cP | 2000 cP | |
| Resinlab® CYNERGY CA6011 Adhesive Description: The CYNERGY 6000 SERIES are for use in demanding applications where very fast cure speeds are required. These are single component solvent free materials manufactured in a wide variety.. |
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| Viscosity | 2000 - 3000 cP @Temperature 25.0 °C |
2000 - 3000 cP @Temperature 77.0 °F |
Uncured |
| Permabond UV620 UV-curable Adhesive PERMABOND UV620 is a single part, fast curing, UV curable adhesive. Its excellent optical clarity and resistance to yellowing make it ideal for bonding glass and crystal for a high quality finish. I.. |
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| Viscosity | 2000 cP | 2000 cP | Mixed |
| Resinlab® EP324E Clear Two Part Epoxy Casting Resin Resinlab™ EP 324E Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wettin.. |
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| Viscosity | 2000 cP @Temperature 121 °C |
2000 cP @Temperature 250 °F |
melt viscosity; ASTM D-3236 |
| ExxonMobil Escorene® UL-7750 EVA Copolymer, Adhesive and Sealant Grade
(discontinued **) Data provided by the manufacturer, Exxon Chemical.A 28% vinyl acetate copolymerApplications: Hot melt adhesives; Wax blends; Industrial sealants. |
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| Viscosity | 2000 - 5000 cP | 2000 - 5000 cP | |
| Huntsman Araldite GY 508 Bisphenol A Epoxy Liquid Resin Weight per Epoxide (EEW, g/eq) 390 to 425. Max color is 5.Comments/Applications: BPA epoxy blended with a polyglycol di-epoxide. The higher EEW allows much lower hardener levels. Flexible resin f.. |
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| Viscosity | 2000 - 3000 cP | 2000 - 3000 cP | 25% Toluene Solution at 25°C; KM 06 |
| Kraton® D1116 A (SBS) Radial Triblock Copolymer Description: Kraton D1116 A is a clear, radial triblock copolymer based on styrene and butadiene with a polystyrene content of 23%. It is supplied from Europe in the physical form identified: Kraton.. |
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| Viscosity | 2000 - 5000 cP | 2000 - 5000 cP | 20% Viscosity, 1-2% NaCl |
| Solvay MACKADET® DR-100M Surfactant Product Description: Mackadet® DR-100M is a concentrated blend of surfactants, which simply requires dilution and the addition of minor additives to produce a ready to package high foaming produc.. |
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| Viscosity | <= 2000 cP | <= 2000 cP | #3 SP @ 12 rpm |
| Solvay MACKANATE® OPV-N Surfactant Product Description: Mackanate OPV-N is a vegetable derived, amido type monoester sulfosuccinate. It is a high foaming surfactant, mild to both eyes and skin with thickening properties. Mackanate OP.. |
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| Viscosity | 2000 - 2300 cP @Temperature 23.0 °C |
2000 - 2300 cP @Temperature 73.4 °F |
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| Master Bond EP42LV Low Viscosity Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP42LV is a low viscosity room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring outstanding chemical
resistance. While EP.. |
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| Viscosity | <= 2000 cP | <= 2000 cP | Unmilled Cement; Zeon Test #328 |
| Zeon Chemicals Nipol® 1052-30 Nitrile Elastomer Nipol 1052-30 is a copolymer of butadiene and acrylonitrile with medium oil resistance. Sufficient non-staining antioxidant is added during manufacture for normal storage conditions.Low Mooney versi.. |
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| Viscosity | 2000 cP @Temperature 23.9 °C |
2000 cP @Temperature 75.0 °F |
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| TSE Industries EcoSPRAY® SS100 Aliphatic Polyurethane Resin TSE-EcoSPRAY® SS100 is an “Environmentally-Preferred Product” or EPP. It is an Aliphatic polyurethane resin free of Styrene, and is an “ultra-low” emitting resin during application. TSE-EcoSPRA.. |
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| Viscosity | 2000 - 3000 cP @Temperature 23.0 °C |
2000 - 3000 cP @Temperature 73.4 °F |
|
| Master Bond EP31 High Shear and Peel Strength Room Temperature Curing Epoxy Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4600 psi. In addition, u.. |
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| Viscosity | 2000 cP | 2000 cP | Dynamic |
| Dow Corning Q2-5247 Fluid Surface active silicone designed for reducing surface tension in silicone emulsions and improving drainage in pulp brownstock washing.Information provided by Dow Corning |
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| Viscosity | 2000 - 4100 cP @Temperature 23.0 °C |
2000 - 4100 cP @Temperature 73.4 °F |
100 rpm |
| Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl.. |
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| Viscosity | 2000 - 4100 cP @Temperature 23.0 °C |
2000 - 4100 cP @Temperature 73.4 °F |
100 rpm |
| Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Viscosity | 2000 - 4000 cP @Temperature 23.0 °C |
2000 - 4000 cP @Temperature 73.4 °F |
100 rpm |
| Epoxy Technology EPO-TEK® H61 Unfilled Epoxy Adhesive Material Description: A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of E.. |
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| Viscosity | 2000 - 3000 cP @Temperature 35.0 °C |
2000 - 3000 cP @Temperature 95.0 °F |
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| C.O.I.M. UREXTER® Lp 285 Polyurethane Two-Component Compound Description: Polyester PU System for shoe sole manufacturingInformation provided by P.A.T. Products, Inc. |
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| Viscosity | 2000 cP | 2000 cP | "B" component |
| ACC QGel 301 QSI Quantum Silicones High Strength Gel QGel 301 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide.. |
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| Viscosity | 2000 cP | 2000 cP | "B" component |
| ACC QLE 1101 QSI Quantum Silicones Specialty Silicone Coating QLE 1101 is a low viscosity, two-component, addition cure, silicone elastomer.Key Features: Fast cure at elevated temperaturesLow linear shrinkageTransparent, ideal for pigmentationLow viscosity Par.. |
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| Viscosity | 2000 cP | 2000 cP | "A" component |
| ACC QLE 1101 QSI Quantum Silicones Specialty Silicone Coating QLE 1101 is a low viscosity, two-component, addition cure, silicone elastomer.Key Features: Fast cure at elevated temperaturesLow linear shrinkageTransparent, ideal for pigmentationLow viscosity Par.. |
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| Viscosity | 2000 cP | 2000 cP | Uncatalyzed, QM 230A |
| ACC QM 230 QSI Quantum Silicones 30 Durometer Addition Cure Moldmaking Material QM 230 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th.. |
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| Viscosity | 2000 cP | 2000 cP | Uncatalyzed, QM 245B |
| ACC QM 245 QSI Quantum Silicones 45 Durometer Addition Cure Moldmaking Material QM 245 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th.. |
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| Viscosity | 2000 cP | 2000 cP | |
| 3M Scotch-Weld™ CA5 Instant Adhesive 3M™ Scotch-Weld™ Instant Adhesives are single component, high strength cyanoacrylate adhesives. Higher viscosity, slower setting version of CA4 for filling gaps. Meets CID A-A-3097, Type II, Clas.. |
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| Viscosity | 2000 cP | 2000 cP | |
| Abatron AboCast 8110-6/AboCure 8110-1 Flexible Epoxy This epoxy system can achieve flexibility and plasticity without sacrificing adhesive, electrical, structural, and other properties. This compound is a clear (unfilled) basic formulation. Its applic.. |
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| Viscosity | 2000 cP @Temperature 177 °C |
2000 cP @Temperature 350 °F |
Typical |
| Bostik 6333 Medium Open Time, Low Viscosity, High Temp EVA Glue Stick Bostik 6333 Medium Open Time, Low Viscosity, High Temp EVA Glue StickMedium open time. Low viscosity. Easy to gun. Withstands elevated temperatures. |
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| Viscosity | 2000 cP | 2000 cP | |
| Resinlab® RC8035 Anaerobic Retaining Compound The RC 8000 Series anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products .. |
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| Viscosity | 2000 cP | 2000 cP | Part B, RVT, #3, 20 rpm; TM R050-12 |
| Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat.. |
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