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Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound for the encapsulation of semiconductor devices and fiber optics. Excellent moldability (good release, minimal flash and bleed, and good hot hardness); Superior cosmetics and markability; Outstanding reliability
Physical Properties Metric English Comments
Density 1.92 g/cc
0.0694 lb/in³
Spiral Flow 66.0 - 90.0 cm
26.0 - 35.4 in
177°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Flexural Strength 124 MPa
18000 psi
Flexural Modulus 14.0 GPa
2030 ksi
Thermal Properties Metric English Comments
CTE, linear, Parallel to Flow 27.0 µm/m-°C

@Temperature 20.0 °C
15.0 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 80.0 µm/m-°C

@Temperature 20.0 °C
44.4 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.900 W/m-K
6.25 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 145 °C
293 °F
Flammability, UL94 V-0

@Thickness 1.60 mm
V-0

@Thickness 0.0630 in
V-0

@Thickness 1.60 mm
V-0

@Thickness 0.0630 in
Electrical Properties Metric English Comments
Dielectric Constant 4.2

@Frequency 1000 Hz
4.2

@Frequency 1000 Hz
Dielectric Strength 17.0 kV/mm
432 kV/in
Dissipation Factor 0.0040

@Frequency 1000 Hz
0.0040

@Frequency 1000 Hz
Arc Resistance 180 sec
180 sec
Processing Properties Metric English Comments
Processing Temperature 171 - 193 °C
340 - 379 °F
Molding temperature
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