Polymer Property : Spiral Flow = 35.4 in Product List

Physical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Physical Properties	Metric	English	Comments
Spiral Flow	66.0 - 90.0 cm	26.0 - 35.4 in	177°C/1000 psi
Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound for the encapsulation of semiconductor devices and fiber optics. Excellent moldability (good release, ..
Spiral Flow	64.0 - 90.0 cm	25.2 - 35.4 in	177°C/1000 psi
Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive.