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Polymer Property : Processing Temperature = 171 °C Product List

Processing Properties

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Processing Properties Metric English Comments
Processing Temperature 171 - 182 °C
340 - 360 °F
Suggested Stock
S&E Specialty Polymers TufFlex™ GA-1042FR-60-0-405 Black TPE Compound
Application: An oil resistant, flexible, 60°C rated jacketing compound.Information provided by S&E Specialty Polymers
Processing Temperature 171 - 182 °C
340 - 360 °F
Suggested Stock
S&E Specialty Polymers TufFlex™ GF 1815 PVC/Nitrile Alloy
Application: A flexible, PVC/Nitrile, oil resistant compound suitable for footwear applications.Information provided by S&E Specialty Polymers
Processing Temperature 171 - 177 °C
340 - 350 °F
Suggested Stock
S&E Specialty Polymers TufLite™ GE-01-037C PVC
Application: An extra flexible, expandable, PVC based compound suitable for injection molding applications.Information provided by S&E Specialty Polymers
Processing Temperature 171 - 177 °C
340 - 350 °F
Suggested Stock
S&E Specialty Polymers TufTech™ G-3468-A PVC Compound
Application: A general purpose PVC based extrusion grade compound.Information provided by S&E Specialty Polymers
Processing Temperature 171 - 182 °C
340 - 360 °F
Suggested Stock
S&E Specialty Polymers TufTech™ GA-1038 Natural MA PVC Compound
Application: A RoHS compliant, 60°C PVC wire and cable compound. Material is suitable for 60°C and 75°C SVT and SJT insulation.Information provided by S&E Specialty Polymers
Processing Temperature 171 - 182 °C
340 - 360 °F
Suggested Stock
S&E Specialty Polymers TufTech™ GA-3210 PVC Compound
Application: 105°C insulating and jacketing material designed to meet UL 62 for SPT-1 and AWM. UL recognized for QMTT2 TW, THW.Information provided by S&E Specialty Polymers
Processing Temperature 171 - 182 °C
340 - 360 °F
Suggested Stock
S&E Specialty Polymers TufTech™ GA-1052-55 PVC Compound
Application: A 105°C scuff, oil and flame resistant high flow molding compound designed for grommets.Information provided by S&E Specialty Polymers
Processing Temperature 171 - 199 °C
340 - 390 °F
Average value: 185 °C Grade Count:13
Overview of materials for Styrenic TPE  (Unverified Data**)
This property data is a summary of similar materials in the MatWeb database for the category "Styrenic TPE". Each property range of values reported is minimum and maximum values of appropriate MatWe..
Processing Temperature 171 - 182 °C
340 - 360 °F
Thermoforming Surface
Chevron Phillips Marlex® HHM 5502-02 LW High Density Ethylene Hexene Copolymer  (discontinued **)
High Density Ethylene Hexene Copolymer with Synthetic AntistatCustomer Benefits: The resin allows the blow molder to reduce inventory of resin types, because it can be used to package bleach and mos..
Processing Temperature 171 - 204 °C
340 - 399 °F
Blow Molding
Chevron Phillips Marlex® HHM 5502-02 LW High Density Ethylene Hexene Copolymer  (discontinued **)
High Density Ethylene Hexene Copolymer with Synthetic AntistatCustomer Benefits: The resin allows the blow molder to reduce inventory of resin types, because it can be used to package bleach and mos..
Processing Temperature 171 - 182 °C
340 - 360 °F
Thermoforming Surface Temp
Chevron Phillips Marlex® HHM 5502-04BN HDPE Hexene Copolymer  (discontinued **)
This resin allows the blow molder to reduce inventory of resin types, because it can be used to package bleach and most detergents. Meets ASTM D4976 - PE 235. ASTM D1248 - Type III, Class A, Cat..
Processing Temperature 171 - 193 °C
340 - 379 °F
Molding temperature
Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound for the encapsulation of semiconductor devices and fiber optics. Excellent moldability (good release, ..
Processing Temperature 171 - 193 °C
340 - 379 °F
Molding temperature
Cookson Group Plaskon® 3200LS Mineral Filled Novolac Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability under very stringent testing. This material is designed to minimize stress on the encapsulated ..
Processing Temperature 171 °C
340 °F
Gel time is 200-300 min. at 171°C.
Huntsman Kerimid 8292 NPM 60-1 Resin
Comments/Applications: Non-MDA polyimide resin solution for use in high temperature circuit boards. Supplied as a 60% by weight solution in MEK and propylene glycol monomethylether.Data provided by..
Processing Temperature 171 - 226 °C
340 - 439 °F
Chevron Phillips Marlex® EHM 6007 High Density Polyethylene
High Density PolyethyleneCustomer Benefits: A blow molding grade rein that offers a high quality product for those critical food packaging jobs and good impact strength and stiffness.Applications: L..
Processing Temperature 171 - 204 °C
340 - 399 °F
Blow Molding
Chevron Phillips Marlex® HHM 5502 BN High Density Ethylene Hexene-1 Copolymer
High Density Ethylene Hexene-1 CopolymerCustomer Benefits: This resin allows the blow molder to reduce inventory of resin types, because it can be used to package a wide range of products. Has exce..
Processing Temperature 171 - 204 °C
340 - 399 °F
Blow Molding
Chevron Phillips Marlex® HHM 5202-02 BN High Density Ethylene Hexene-1 Copolymer
High Density Ethylene Hexene-1 CopolymerCustomer Benefits: For the blow molder who wants to stock one resin that will be suitable for most of his customers' packaging needs. Lightweight containers ..
Processing Temperature 171 - 193 °C
340 - 379 °F
Molding temperature
Cookson Group Plaskon® 3300S Mineral Filled Novolac Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, flame retardant, novolac hardened epoxy molding compound designed to provide hermeticity protection exceeding that ..
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