Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheology provides a smooth paste with excellent handling characteristics and a reasonable pot life. It can be machine-dispensed, screen printed, stamped, or applied by hand using spatula, toothpick, or many other applicators.Suggested for the following:Semiconductor applications such as Au-plated chips, Si, GaAs, Cu or Ag based lead-frames and die-paddles, JEDEC plastic IC packaging using transfer molded encapsulation processes.Hybrid micro-electronics; active and passive SMDs on ceramic substrates, Au and Ag-Pd contact pads, chip caps and resistors, inductors, quartz crystals, oscillators, making or repairing conductive traces on the PCB, EMI/RF shielding of the package, near-hermetic sealing, component or package grounding. Packages like DIP, or TO-can format.PCB level; COB die attach, substrates can be rigid like FR4 and BT, or flex like Kapton.Passes NASA low outgassing standard ASTM E595 with proper cureDesigned to withstand TC wire bonding temperatures, or hybrid lid-seal processes exceeding 300°C.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.22 g/cc
1.22 g/cc
Part B
3.79 g/cc
3.79 g/cc
Part A
Particle Size <= 45 µm
<= 45 µm
Viscosity 2500 - 4000 cP

@Temperature 23.0 °C
2500 - 4000 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 55
55
Tensile Modulus 3.719 GPa
539.4 ksi
Storage
Shear Strength 8.880 MPa
1288 psi
Lap
>= 35.2 MPa
>= 5100 psi
Die
Thermal Properties Metric English Comments
CTE, linear 29.0 µm/m-°C
16.1 µin/in-°F
Below Tg
116 µm/m-°C
64.4 µin/in-°F
Above Tg
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 225 °C
437 °F
Continuous
325 °C
617 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 413 °C
775 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 25 ppm
25 ppm
Ionic Impurities - K (Potassium) 10 ppm
10 ppm
Ionic Impurities - Cl (Chloride) 8.0 ppm
8.0 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Minimum Bond Line
Pot Life 480 min
480 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Silver
Part A
Consistency Smooth paste
Ionic Impurities NH4 7 ppm
Mix Ratio By Weight 10:1
Number of Components Two
Thixotropic Index 1.3
Weight Loss 0.49%
200°C
0.5%
250°C
0.63%
300°C
Copyright © lookpolymers.com All Rights Reserved