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Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & Application Notes: The thixotropic and paste-like rheology allows for application by screen or stencil printing techniques. It was designed to be printed for SMT joining similar to printing solder paste. It may also be hand applied or dispensed.A “lead-free” solution for PCB level circuit assemblies. It is suggested to use this epoxy with SMDs that do not contain Pb plated leads. Preferable to solder: Snap cure adhesive or fast-cure; chips can be cured in-line < 90 seconds travel time; or lead-frames can be loaded into magazines for box oven curing
Physical Properties Metric English Comments
Specific Gravity 2.84 g/cc
2.84 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 11000 - 14000 cP

@Temperature 23.0 °C
11000 - 14000 cP

@Temperature 73.4 °F
20 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Tensile Modulus 2.15 GPa
312 ksi
Storage
Shear Strength 10.26 MPa
1488 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 24.0 µm/m-°C
13.3 µin/in-°F
Below Tg
77.0 µm/m-°C
42.8 µin/in-°F
Above Tg
Thermal Conductivity 1.09 W/m-K
7.56 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 435 °C
815 °F
Degradation Temperature; TGA
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 6.0 ppm
6.0 ppm
Ionic Impurities - K (Potassium) 4.0 ppm
4.0 ppm
Ionic Impurities - Cl (Chloride) 125 ppm
125 ppm
Processing Properties Metric English Comments
Cure Time 2.00 min

@Temperature 180 °C
0.0333 hour

@Temperature 356 °F
Minimum Bond Line
15.0 min

@Temperature 150 °C
0.250 hour

@Temperature 302 °F
Minimum Bond Line
Pot Life 1440 min
1440 min
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color Silver
Consistency Smooth, Thixotropic Paste
Ionic Impurities NH4 27 ppm
Number of Components Single
Thixotropic Index 3.9
Weight Loss 0.23%
300°C
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