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Epoxy Technology EPO-TEK® H37-MPT Epoxy
| Category | Polymer , Thermoset , Epoxy |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® H37-MPT Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of MIL-STD 883 /Test Method 5011. It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly.Information Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 3.37 g/cc | 3.37 g/cc | |
| Particle Size | <= 20 µm | <= 20 µm | |
| Viscosity | 80000 - 110000 cP @Temperature 23.0 °C |
80000 - 110000 cP @Temperature 73.4 °F |
2.5 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 76 | 76 | |
| Tensile Modulus | 3.72 GPa | 539 ksi | Storage |
| Shear Strength | 11.69 MPa | 1696 psi | Lap |
| >= 23.4 MPa | >= 3400 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 44.0 µm/m-°C | 24.4 µin/in-°F | Below Tg |
| 108 µm/m-°C | 60.0 µin/in-°F | Above Tg | |
| Thermal Conductivity | 2.82 W/m-K | 19.6 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 200 °C | 392 °F | Continuous |
| 300 °C | 572 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| -55.0 °C | -67.0 °F | Continuous | |
| Glass Transition Temp, Tg | >= 90.0 °C | >= 194 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Decomposition Temperature | 350 °C | 662 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.00050 ohm-cm | <= 0.00050 ohm-cm |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | <= 50 ppm | <= 50 ppm | |
| Ionic Impurities - K (Potassium) | <= 50 ppm | <= 50 ppm | |
| Ionic Impurities - Cl (Chloride) | <= 200 ppm | <= 200 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
Minimum |
| Pot Life | 40320 min | 40320 min | |
| Shelf Life | 12.0 Month @Temperature -40.0 °C |
12.0 Month @Temperature -40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Silver | |
| Consistency | Smooth thixotropic paste | |
| Ionic Impurities NH4 | 53 ppm | |
| Number of Components | Single | |
| Weight Loss | 0.01% | 200°C |
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