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Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy can be classified as a higher viscosity version of EPO-TEK® E3035, suggested for the following purposes: Used for improved stencil printing via small apertures. Less flow-out between small pads like 0402 or 0603 caps and resistors. Performs exceptionally well as a die attach for small chips such as GaAs, LEDs and diodes. Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-seal processes near 300°C, and organic burn-in up to 150°C/1000 hours storage. Low levels of water extractable monovalent ions such as Chlorides. Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames. Widely used epoxy; popular choice for silver-filled epoxies; opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT Contact techserv@epotek.com for your best recommendation. Alternate viscosities and lower curing temperatures are available.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.13 g/cc
1.13 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 80000 - 120000 cP

@Temperature 23.0 °C
80000 - 120000 cP

@Temperature 73.4 °F
2.5 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Tensile Modulus 2.55 GPa
369 ksi
Storage
Shear Strength 12.25 MPa
1776 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 42.0 µm/m-°C
23.3 µin/in-°F
Below Tg
80.0 µm/m-°C
44.4 µin/in-°F
Above Tg
Thermal Conductivity 1.44 W/m-K
9.99 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 390 °C
734 °F
Degradation Temperature; TGA
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 21 ppm
21 ppm
Ionic Impurities - K (Potassium) 3.0 ppm
3.0 ppm
Ionic Impurities - Cl (Chloride) 62 ppm
62 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 180 °C
1.00 hour

@Temperature 356 °F
Minimum Bond Line
Pot Life 40320 min
40320 min
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color Silver
Consistency Thixotropic paste
Ionic Impurities NH4 24 ppm
Number of Components Single
Thixotropic Index 4.09
Weight Loss 0.15%
200°C
0.29%
250°C
0.32%
300°C
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