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- Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy
| Category | Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, free flowing, slightly thixotropic paste, using a 100% solids system. It can be dispensed, screen printed, or manually applied.High Tg allows it to be used for high temperature applications.Outstanding high temperature properties and excellent solvent, chemical and moisture resistance.Extended pot life and fast curing at relatively low temperatures < 100°C.Designed to be used in the 300°C range for applications such as wire bonding operations and eutectic lid-sealing processes.Contains no solvents or thinners. Passes NASA low outgassing standard ASTM E595 with proper cureCan be used instead of eutectic solders for near-hermetic sealing.Information Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.03 g/cc | 1.03 g/cc | Part B |
| 2.03 g/cc | 2.03 g/cc | Part A | |
| Particle Size | <= 45 µm | <= 45 µm | |
| Viscosity | 12000 - 20000 cP @Temperature 23.0 °C |
12000 - 20000 cP @Temperature 73.4 °F |
20 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 80 | 80 | |
| Tensile Modulus | 3.7240 GPa | 540.12 ksi | Storage |
| Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
| 13.7 MPa | 1980 psi | Lap |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 39.0 µm/m-°C | 21.7 µin/in-°F | Below Tg |
| 224 µm/m-°C | 124 µin/in-°F | Above Tg | |
| Thermal Conductivity | 0.940 W/m-K | 6.52 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 250 °C | 482 °F | Continuous |
| 350 °C | 662 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Decomposition Temperature | 454 °C | 849 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.00050 ohm-cm | <= 0.00050 ohm-cm |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | 60 ppm | 60 ppm | |
| Ionic Impurities - K (Potassium) | 6.0 ppm | 6.0 ppm | |
| Ionic Impurities - Cl (Chloride) | 175 ppm | 175 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Minimum Bond Line |
| 10.0 min @Temperature 120 °C |
0.167 hour @Temperature 248 °F |
Minimum Bond Line | |
| 20.0 min @Temperature 100 °C |
0.333 hour @Temperature 212 °F |
Minimum Bond Line | |
| Pot Life | 960 min | 960 min | |
| Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Amber | Part B |
| Silver | Part A | |
| Consistency | Smooth flowing paste | |
| Ionic Impurities NH4 | 148 ppm | |
| Mix Ratio By Weight | 100:4.5 | |
| Number of Components | Two | |
| Thixotropic Index | 2.36 | |
| Weight Loss | 0.09% | 200°C |
| 0.23% | 250°C | |
| 0.42% | 300°C |
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