Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy

Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also available in a frozen syringe.Advantages & Application Notes: Designed specifically to meet the requirements pertaining to the MIL-STD 883/Test Method 5011 for military hybrids.Can be considered a lower stress, and lower cure temperature alternative to EPO-TEK® H35-175MP.Compliant material; eliminates cracking when bonding large components or substrates. Excellent adhesion to ceramic, Si, Au, kovar, Au/kovar and AgPd.May also be used on lead-frames and die-paddles compatible with JEDEC plastic IC packaging.Adaptable to conventional processing methods such as automatic dispensing or screen printing.Passes NASA low outgassing standard ASTM E595 with proper cureInformation Provided by Epoxy Technology