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Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used. Advantages & Application Notes: Ease of use: smooth flowing paste allows for automated dispensing, stamping, brushing, or hand applications. In some cases, the low viscosity nature of the paste allows it to be sprayed onto targets.Suggested applications include: EMI and Rf shielding, ITO interconnects in LCDs, low temperature cryogenic cooling.Exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics. Hybrid / Micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.Bright and shiny silver epoxy; provides a metallic-like layer after cure.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 0.950 g/cc
0.950 g/cc
Part B
3.10 g/cc
3.10 g/cc
Part A
Particle Size <= 45 µm
<= 45 µm
Viscosity 800 - 1600 cP

@Temperature 23.0 °C
800 - 1600 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 60
60
Tensile Modulus 3.58 GPa
519 ksi
Storage
Shear Strength 8.729 MPa
1266 psi
Lap
>= 11.7 MPa
>= 1700 psi
Die
Thermal Properties Metric English Comments
CTE, linear 48.0 µm/m-°C
26.7 µin/in-°F
Below Tg
150 µm/m-°C
83.3 µin/in-°F
Above Tg
Thermal Conductivity 1.37 W/m-K
9.51 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Continuous
250 °C
482 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 380 °C
716 °F
Degradation Temperature; TGA
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
<= 0.00070 ohm-cm
<= 0.00070 ohm-cm
25°C/40-60%RH/3 Day cure
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 23 ppm
23 ppm
Ionic Impurities - K (Potassium) 31 ppm
31 ppm
Ionic Impurities - Cl (Chloride) 151 ppm
151 ppm
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 150 °C
0.250 hour

@Temperature 302 °F
Minimum Bond Line
180 min

@Temperature 80.0 °C
3.00 hour

@Temperature 176 °F
Minimum Bond Line
360 min

@Temperature 60.0 °C
6.00 hour

@Temperature 140 °F
Minimum Bond Line
4320 min

@Temperature 23.0 °C
72.0 hour

@Temperature 73.4 °F
Minimum Bond Line
Pot Life 240 min
240 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Clear/Colorless
Part B
Silver
Part A
Consistency Smooth flowing paste
Ionic Impurities NH4 23 ppm
Mix Ratio By Weight 10:1
Number of Components Two
Thixotropic Index 2.1
Weight Loss 0.7%
200°C
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