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- Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy
| Category | Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or fast-cure; chips can be cured in-line < 90 seconds travel time; or lead-frames can be loaded into magazines for box oven curing
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.04 g/cc | 1.04 g/cc | Part B |
| 2.67 g/cc | 2.67 g/cc | Part A | |
| Particle Size | <= 20 µm | <= 20 µm | |
| Viscosity | 11000 - 14000 cP @Temperature 23.0 °C |
11000 - 14000 cP @Temperature 73.4 °F |
20 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 80 | 80 | |
| Tensile Modulus | 2.15 GPa | 312 ksi | Storage |
| Shear Strength | 10.26 MPa | 1488 psi | Lap |
| >= 23.4 MPa | >= 3400 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 24.0 µm/m-°C | 13.3 µin/in-°F | Below Tg |
| 77.0 µm/m-°C | 42.8 µin/in-°F | Above Tg | |
| Thermal Conductivity | 1.09 W/m-K | 7.56 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 200 °C | 392 °F | Continuous |
| 300 °C | 572 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Decomposition Temperature | 435 °C | 815 °F | Degradation Temperature; TGA |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | >= 0.00050 ohm-cm | >= 0.00050 ohm-cm |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | 6.0 ppm | 6.0 ppm | |
| Ionic Impurities - K (Potassium) | 4.0 ppm | 4.0 ppm | |
| Ionic Impurities - Cl (Chloride) | 125 ppm | 125 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 2.00 min @Temperature 180 °C |
0.0333 hour @Temperature 356 °F |
Bond Line |
| 15.0 min @Temperature 150 °C |
0.250 hour @Temperature 302 °F |
Bond Line | |
| Pot Life | 1440 min | 1440 min | |
| Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Amber | Part B |
| Silver | Part A | |
| Consistency | Smooth Thixotropic Paste | |
| Ionic Impurities NH4 | 27 ppm | |
| Mix Ratio By Weight | 100:3 | |
| Number of Components | Two | |
| Thixotropic Index | 3.9 | |
| Weight Loss | 0.23% | 300°C |
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