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Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
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Material Notes:
Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21ND-LO has a convenient one to one mix ratio by weight. It has a paste-like viscosity after mixing. EP21ND-LO can be applied without sagging or dripping even on vertical surfaces. EP21ND-LO produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals.
Mechanical Properties Metric English Comments
Hardness, Shore D >= 70
>= 70
Tensile Strength >= 51.7 MPa
>= 7500 psi
Elongation at Break >= 5.0 %
>= 5.0 %
Tensile Modulus >= 2.07 GPa
>= 300 ksi
Compressive Strength >= 68.9 MPa
>= 10000 psi
Adhesive Bond Strength >= 17.2 MPa
>= 2500 psi
shear, Al/Al
Thermal Properties Metric English Comments
CTE, linear 50.0 - 55.0 µm/m-°C
27.8 - 30.6 µin/in-°F
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+14 ohm-cm
>= 1.00e+14 ohm-cm
Dielectric Constant 2.92

@Frequency 60.0 Hz
2.92

@Frequency 60.0 Hz
Processing Properties Metric English Comments
Cure Time 120 - 180 min

@Temperature 93.3 °C
2.00 - 3.00 hour

@Temperature 200 °F
720 - 1440 min

@Temperature 23.9 °C
12.0 - 24.0 hour

@Temperature 75.0 °F
plus 2 hrs at 150-200°F
2880 - 4320 min

@Temperature 23.9 °C
48.0 - 72.0 hour

@Temperature 75.0 °F
Pot Life 90 - 120 min
90 - 120 min
100 gram mass
Shelf Life 12.0 Month

@Temperature 23.9 °C
12.0 Month

@Temperature 75.0 °F
in original unopened containers
Descriptive Properties Value Comments
Mixing Ratio (A to B) 1:1
Viscosity Paste
Mixed compound, 75°F
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