Polymer Property : Cure Time = 48.0 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-A60A Liquid Castable Polyurethane MPP-A60A is a room-temperature-cure liquid castable polyurethane system. This ether-base polyurethane system is used in applications such as mold-making, prototyping, production of cast parts, pott..
Cure Time	2880 - 4320 min @Temperature 25.0 °C	48.0 - 72.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-D65A Polyether Base Polyurethane Resin MPP-D65A is a polyether base 2-component polyurethane resin casting system for molding and potting applications. It has a long pot-life and gradual curing pattern to provide easier handling for mol..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-M09D "Slow Cure" Semi-Rigid Foam Formulation This foam polyurethane formulation is designed yield structural foam by either hand-mixing or machine casting method. The pot-life of this material is set longer than ordinary rigid foam formulatio..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MSB-M25F Microcellular Foam based on High Performance Polyester Polyurethane This high performance polyester microcellular foam system is one of a family of polymer systems developed by Northstar Polymers for demanding work environments. Urethane foams molded with this syste..
Cure Time	2880 min @Temperature 23.0 °C	48.0 hour @Temperature 73.4 °F
Resin Technology Group 1114 Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Cure Time	2880 min @Temperature 23.0 °C	48.0 hour @Temperature 73.4 °F
Resin Technology Group 119-EX Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Cure Time	2880 - 4320 min @Temperature 23.0 °C	48.0 - 72.0 hour @Temperature 73.4 °F
Master Bond EP37-3FLF Low Exotherm Highly Flexible Two Component Epoxy Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. The ..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 342-1 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-1 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials, such a..
Cure Time	2880 - 3600 min @Temperature 23.0 °C	48.0 - 60.0 hour @Temperature 73.4 °F
Master Bond EP21BAS Radiopaque Two Component Epoxy Master Bond Polymer System EP21BAS is a radiopaque epoxy compound which offers outstanding performance and superior processability. Radiopaque epoxy polymer compounds are employed for medical diagno..
Cure Time	2880 min @Temperature 23.0 °C	48.0 hour @Temperature 73.4 °F
Master Bond EP30DP Abrasion Resistant Cryogenic Epoxy Urethane System Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, se..
Cure Time	2880 - 4320 min @Temperature 23.0 °C	48.0 - 72.0 hour @Temperature 73.4 °F
Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or mor..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals Description: Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..
Cure Time	2880 min @Temperature 10.0 °C	48.0 hour @Temperature 50.0 °F	Full Load
Chesterton ARC 10 Paste grade machinable composite Description: A reinforced composite for the repair and protection of metal surfaces. It is machinable with excellent compressive strength, chemical resistance and corrosion resistance. It is non-sag..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F	Full Chemical
Chesterton ARC BX2 Contractor Grade Fine Sliding Wear Compound Description: ARC BX2 is an advanced contractor grade ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It ..
Cure Time	2880 min @Temperature 10.0 °C	48.0 hour @Temperature 50.0 °F	Full Load
Chesterton ARC MX1 Vertical Build Extreme Wear Compound Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, abrasion and chemical attack. It is applied at a thickness of 6 mm (1/4”)..
Cure Time	2880 min @Temperature 16.0 °C	48.0 hour @Temperature 60.8 °F	Full Load
Chesterton ARC PW Potable Water Coating Description: ARC PW is a 100% solids lining certified for NSF/ANSI 61 potable water, cold water service. It is recommended to be applied by brush, roll or spray at 500-750 microns (20-30 mils) total..
Cure Time	2880 min @Temperature 16.0 °C	48.0 hour @Temperature 60.8 °F	Full Load
Chesterton MRS SD4i Metal Rebuilding System An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10 – 15 mils) per coat. Non-shri..
Cure Time	2880 min @Temperature 23.0 °C	48.0 hour @Temperature 73.4 °F	Minimum
Epoxy Technology EPO-TEK® T7109-18 Electrically Insulating Epoxy Paste Material Description: A flexible, electrically insulating epoxy paste designed for low stress and heat dissipation applications. Alternative to EPO-TEK® T7109-17.Information Provided by Epoxy Tec..
Cure Time	2880 min @Temperature 16.0 °C	48.0 hour @Temperature 60.8 °F	Full Load
Chesterton ARC MX2 High Wear Fine Particle Wear Compound Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”..
Cure Time	2880 min @Temperature 22.0 °C	48.0 hour @Temperature 71.6 °F
Dow Corning 3-4130 DIELECTRIC GEL KIT Two-part, clear, heat cure, low extractables.Information provided by Dow Corning
Cure Time	2880 - 10080 min @Temperature 20.0 °C	48.0 - 168.0 hour @Temperature 68.0 °F	(2-7 Days)
Abatron AboCast 8005-6/AboCure 8005-6 Epoxy AboCast 8005-6 is a tan, viscous filled liquid resin with a weight of approximately 11 lbs/gallon. AboCure 8005-6 is an amber, viscous liquid converter with a weight of approximately 10 lbs/gallon. ..
Cure Time	2880 min @Temperature 24.0 °C	48.0 hour @Temperature 75.2 °F	full cure
BCC Products BC 9020 Silicone RTV Rubber BC 9020 is a violet colored, two-component, flowable compound that regardless of thickness or confinement, cures at room temperature. The cured rubber is high strength and high tear with good elonga..
Cure Time	2880 min @Temperature 22.0 °C	48.0 hour @Temperature 71.6 °F	50% RH; Full Cure
Parker Chomerics CHO-FORM 5531 EMI Shielding Material One component, moisture cure, form-in-place EMI gasketing material. This electrically conductive formulation contains silver-plated copper particles dispersed in a silicone elastomer. It is designed..
Cure Time	2880 min @Temperature 22.0 °C	48.0 hour @Temperature 71.6 °F	50% RH; Full Cure
Parker Chomerics CHO-FORM 5538 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP33LV Epoxy Has Dimensional Stability and Machinability Description: Master Bond EP33LV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..