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Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals.pdf
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Material Notes:
Description: Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very good chemical resistance. This paste consistency system is also much easier to machine compared to most other epoxies. It has a 100 to 70 mix ratio by weight and a very convenient one to one ratio by volume. EP33ND cures readily at room temperature or more rapidly at elevated temperatures. To optimize its properties, the recommended cure schedule is overnight at room temperature followed by a post cure at 150-200°F for 2-3 hours. After curing, this system has a high temperature resistance, serviceable up to 450°F. It resists a range of chemicals including water, oils, fuels and many acids and bases. EP33ND bonds well to a wide variety of substrates including metal, glass, ceramics and many rubbers and plastics. It is a reasonably good electrical insulator. EP33ND is 100% reactive and does not contain any diluents or solvents. The color of Part A is gray, Part B is amber. It is widely used in aerospace, electronic, electrical and specialty OEM type applications. Product Advantages: Convenient mixing: one to one ratio by volume. Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly. High temperature resistance up to 450°F. Excellent chemical resistance. Outstanding dimensional stability. Readily machinable. Good adhesion to a wide variety of substrates.Information provided by MasterBond®
Physical Properties Metric English Comments
Viscosity 400000 - 600000 cP
400000 - 600000 cP
Part B
Mechanical Properties Metric English Comments
Hardness, Shore D 85 - 90
85 - 90
Tensile Strength at Break >= 55.2 MPa
>= 8000 psi
Tensile Modulus 3.45 GPa
500 ksi
Shear Strength >= 13.8 MPa
>= 2000 psi
Bond, Al to Al
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 232 °C
450 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+12 ohm-cm
>= 1.00e+12 ohm-cm
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
2880 - 4320 min

@Temperature 23.9 °C
48.0 - 72.0 hour

@Temperature 75.0 °F
Pot Life 75 - 120 min
75 - 120 min
100 gram batch
Shelf Life 12.0 Month

@Temperature 23.9 °C
12.0 Month

@Temperature 75.0 °F
in original unopened container
Descriptive Properties Value Comments
Mixing Ratio (A to B) 1:1
by volume
100:70
by weight
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